Please review product documents or contact us for the latest agency approval information. 

Please Note: Use the Product Drawing for all design activity. 

• Connector System : Wire-to-Board

• Connector & Housing Type : Plug

• Connector & Contact Terminates To : Printed Circuit Board, Wire & Cable

• Ribbon Cable Connector Header Type : Pin Header

• Connector Product Type : Connector Assembly

• Number of Positions : 26

• PCB Mount Orientation : Vertical

• Number of Rows : 2

• Centerline (Pitch) : 2.54 mm [ .1 in ]

• Housing Material : Thermoplastic

• PCB Mount Retention : Without

• Mating Alignment Type : Polarization

• Mating Retention : Without

• Connector Mounting Type : Board Mount

• PCB Mount Alignment : Without

• Mating Alignment : With

• Panel Mount Feature : Without

• Termination Method to PCB : Through Hole - Solder

• Termination Post & Tail Length : 3.96 mm [ .156 in ]

• Termination Method to Wire & Cable : Insulation Displacement (IDC)

• Rectangular Termination Post & Tail Thickness : .32 mm [ .013 in ]

• Rectangular Termination Post & Tail Width : .5 mm [ .02 in ]

• Row-to-Row Spacing : 2 mm [ .1 in ]

• Wire Size (AWG): 30 – 26

• Connector Length : 37.59 mm [ 1.48 in ]

• Wire Size (mm²): .051 – .15

• Connector Height : 6.43 mm [ .253 in ]

• PCB Thickness (Recommended) : 3.18 mm [ .125 in ]

• Wire Size (CMA): 101 – 296

• Connector Width : 7.06 mm [ .278 in ]

• Compatible Insulation Diameter Range : .81 – 1.07 mm [ .032 – .042 in ]

• Connector Profile : Standard

• Primary Product Color : Black

• Daisy Chain : Without

• Contact Current Rating (Max) (A): 1

• Contact Type : Pin

• Wire Contact Termination Area Plating Thickness : .127 µm [ 5 µin ]

• PCB Contact Termination Area Plating Material : Tin

• Contact Base Material : Phosphor Bronze

• Contact Layout : Inline

• PCB Contact Termination Area Plating Material Thickness : 2.54 – 5.08 µm [ 100 – 200 µin ]

• Wire Contact Termination Area Plating Material : Gold

• Contact Mating Area Plating Material Thickness : 2.54 µm [ 100 µin ]

• Circuit Application : Signal

• Solder Process Feature : Solder Dipped

• Operating Temperature Range : -65 – 105 °C [ -85 – 221 °F ]

• EU RoHS Compliance : Compliant

• EU ELV Compliance : Compliant

• Insulation Resistance (MΩ): 5000

• Operating Voltage (VAC): 250

• Compatible With Approved Standards Products : UL E28476, CSA LR7189

• UL Flammability Rating : UL 94V-0

• UL Rating : Recognized

• Compatible With Agency/Standards Products : UL, CSA