Please review product documents or contact us for the latest agency approval information. 

• Applied Pressure : Standard

• Insulation Resistance (MΩ): 5000

• Dielectric Withstanding Voltage (Max) (V): 1200

• Contact Resistance (mΩ): 15

• Contact Mating Area Plating Material Thickness : .8 µm [ 31.496 µin ]

• PCB Contact Termination Area Plating Material : Tin

• Contact Orientation : Straight

• PCB Contact Termination Area Plating Material Thickness : .7999984 µm [ 31.496 µin ]

• Contact Type : Socket

• Contact Mating Area Plating Material : Tin (Sn)

• Contact Base Material : Phosphor Bronze

• Contact Current Rating (Max) (A): 5

• Termination Method to Wire & Cable : Crimp

• Product Terminates To : Wire & Cable

• PCB Mount Retention : Without

• Wire Insulation Support : With

• Contact Retention Type Within Housing : Snap-In

• Mating Entry Location : Top

• Compatible Insulation Diameter Range : 1.8 – 2.3 mm [ .071 – .091 in ]

• Wire Size (AWG): 22 – 18

• Wire Size (mm²): .3 – .9

• Operating Temperature Range : -40 – 105 °C [ -40 – 221 °F ]

• Circuit Application : Signal