Please review product documents or contact us for the latest agency approval information. 

Please Note: Use the Product Drawing for all design activity. 

• Sealable : No

• Contact Mating Area Plating Material Finish : Bright

• Wire Contact Termination Area Plating Thickness : 5.08 – 10.16 µm [ 200 – 400 µin ]

• Wire Contact Termination Area Plating Material Finish : Bright

• Contact Mating Area Plating Material Thickness : 5.08 – 10.16 µm [ 200 – 400 µin ]

• Contact Underplating Material Thickness : 1.27 – 3.8 µm [ 50 – 150 µin ]

• Mating Pin Diameter : 6 mm [ .23 in ]

• Contact Orientation : Straight

• Contact Underplating Material : Nickel

• Contact Type : Socket

• Contact Mating Area Plating Material : Silver (Ag)

• Wire Contact Termination Area Plating Material : Silver

• Contact Retention Within Housing : With

• Contact Base Material : Copper Alloy

• Contact Current Rating (Max) (A): 24

• Termination Method to Wire & Cable : Crimp

• Product Terminates To : Wire & Cable

• Wire Insulation Support : Without

• Wire Size (AWG): 4

• Wire Size (mm²): 21.1

• Wire Size (CMA): 41740

• Operating Temperature Range : -40 – 105 °C [ -40 – 221 °F ]

• Circuit Application : Power