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• Connector & Contact Terminates To : Printed Circuit Board

• DRAM Type : Non-Buffered

• Connector System : Board-to-Board

• Number of Rows : 2

• Number of Keys : 2

• Number of Bays : 3

• Number of Positions : 100

• Module Orientation : Vertical

• DRAM Voltage (V): 3.3

• Ejector Location : Both Ends

• Module Key Type : Key1= Offset Right / Key2= Center

• Connector Profile : Standard

• Retention Post Location : Both Ends

• PCB Retention Feature Material : Phosphor Bronze

• Ejector Type : Standard

• Contact Mating Area Plating Material Thickness : .38 µm [ 15 µin ]

• PCB Contact Termination Area Plating Material : Tin

• Contact Base Material : Phosphor Bronze

• Memory Socket Type : Memory Card

• Contact Mating Area Plating Material : Gold (Au)

• Socket Style : DIMM 2P

• PCB Contact Termination Area Plating Material Thickness : 3.81 – 6.35 µm [ 150 – 250 µin ]

• Contact Current Rating (Max) (A): .5

• Termination Post & Tail Length : 2.6 mm [ .102 in ]

• Insertion Style : Direct Insert

• PCB Mount Alignment Type : Locating Posts

• PCB Mount Retention : With

• Mating Alignment : Without

• Mating Alignment Type : None

• PCB Mount Retention Type : Boardlock

• Mount Angle : Vertical

• Connector Mounting Type : Board Mount

• Housing Material : Glass-Filled High Temperature Nylon

• Housing Color : Black

• Centerline (Pitch) : 1.27 mm [ .05 in ]

• Profile Height from PCB : 23.82 mm [ .93 in ]

• Row-to-Row Spacing : 1.9 mm [ .075 in ]

• Circuit Application : Signal

• UL Flammability Rating : UL 94V-0