Industry Tradeshow
OFC 2025
Join TE Connectivity at OFC 2025!
April 1-3, 2025
San Francisco, CA
Booth #5045
Innovative Connectivity Solutions, From Copper to Optics
TE Connectivity (TE) is driving the future of artificial intelligence (AI) and machine learning (ML) through next generation higher speed, higher density solutions. TE’s robust passive and active electrical and optical connectivity portfolio is helping to optimize the latest data center, edge and telecommunication innovations, delivering speed, scalability, reach, power efficiency, and improved thermal management.
From copper to optics, TE provides cutting-edge solutions to meet today’s processing needs and anticipate tomorrow’s forward-thinking designs.
Product Solutions on Display
at OFC 2025
Active Optical Cable Assemblies
Ultra High-Density Connector for Co-Packaged Copper Applications
Ultra Low-Profile PCIe Gen 7.0 Interconnect Solution
Co-Packaged Copper Connector for 224G AI & Networking
224G Active Cabling Solutions
Advanced High-Speed I/O Liquid Cooling & Thermal Bridge Hybrid Solution
Connectivity Solutions Empowering the AI Evolution
Liquid Cooled Power Busbar Assembly
Industry Tradeshow
OFC 2025
Join TE Connectivity at OFC 2025!
April 1-3, 2025
San Francisco, CA
Booth #5045
Innovative Connectivity Solutions, From Copper to Optics
TE Connectivity (TE) is driving the future of artificial intelligence (AI) and machine learning (ML) through next generation higher speed, higher density solutions. TE’s robust passive and active electrical and optical connectivity portfolio is helping to optimize the latest data center, edge and telecommunication innovations, delivering speed, scalability, reach, power efficiency, and improved thermal management.
From copper to optics, TE provides cutting-edge solutions to meet today’s processing needs and anticipate tomorrow’s forward-thinking designs.
Product Solutions on Display
at OFC 2025
Active Optical Cable Assemblies
Ultra High-Density Connector for Co-Packaged Copper Applications
Ultra Low-Profile PCIe Gen 7.0 Interconnect Solution
Co-Packaged Copper Connector for 224G AI & Networking
224G Active Cabling Solutions
Advanced High-Speed I/O Liquid Cooling & Thermal Bridge Hybrid Solution
Connectivity Solutions Empowering the AI Evolution
Liquid Cooled Power Busbar Assembly
