OFC 2025

Rack-Level Solutions: Showcasing TE's innovative connectivity solutions for compute, switch, storage, and power, including our innovative liquid cooled power busbar assembly. 

1.6T OSFP224 DR8 Optical Transceiver for Ethernet & InfiniBand Applications: This innovative module delivers unprecedented data transmission speeds of up to 1.6T, doubling the capacity of current 800G solutions. It is designed to meet the demands of next-generation data centers, AI workloads, and hyperscale environments. 

OSFP-XD LPO Transceiver for PCIe Gen 6 Connectivity Over Optics: This innovative module is suitable for PCIe Gen 6 (64 GT/s per lane), delivering a total bandwidth of up to 256 GB/s in a 16-lane configuration, all while maintaining an impressively low power consumption of just 8.5W. It is ideal for applications based on disaggregated server architecture enabling connectivity between components without sacrificing bandwidth or signal integrity. This demo is supported in partnership with MACOM. 

Co-Packaged Copper Connector (in ultra-miniaturized size) for 224G AI and Networking: In this demo, TE is showcasing a 1024 differential pair (DP) switch, utilizing its highest-density co-packaged copper connector/cable assembly – the Ultra High-Density (UHD) AdrenaLINE Catapult connector. 

Enabling Faceplate Optics: This demo showcases TE’s 224G OSFP connector with internal twinax copper cables (365mm) reaching over-the-board (OTB) to an AdrenaLINE Catapult near-chip connector. This OTB internal cabled host technology enables high speed signals to avoid being routed across lossy traces on expensive, densely routed PCBs, while providing excellent reach extensions for near-chip and co-packaged copper-cable architectures. MultiLane is providing their 800G BERT equipment to support this demonstration.

Advanced High-Speed I/O Liquid Cooling & Thermal Bridge Hybrid Solution: In this demo, TE is showcasing our next-generation thermal solution for future high-speed I/O products. By combining TE's patented thermal bridge components with a liquid cooling cold plate structure, TE presents the market with this efficient and innovative technology for addressing some of the most challenging thermal problems. 

Ultra Low-Profile (ULP) PCIe Gen 7.0 Internal Cable Interconnect Solution: TE's ULP Gen 7 provides a low-profile solution of sub 9 mm height, while offering superior signal integrity performance and enabling PCIe Gen 7 transmission performance. This demo, powered by Marvell's 128 Gbps SerDes silicon, showcases PCIe Gen 7 traffic through the ULP cable assembly and receptacle.

 224G Passive Copper Cabling 

See more of TE's innovative solutions at our partner booths:

Ethernet Alliance (Booth 5173)

OIF (5745)

Alphawave Semi (Booth 5646)

Marvell (Booth 2129)

MultiLane (Booth 5101)

Semtech (Booth 1028)

Spirent (Booth 5180)