LITESURF TIN-FREE ELECTROPLATING FOR PRESS-FIT TECHNOLOGY: Environmentally safe solution for tin whisker growth prevention
TE Connectivity’s LITESURF plating technology offers ultra-low risk of whisker growth in automotive electronic components. After around four years of development and intense research, TE Connectivity’s Bi-based LITESURF plating now provides a reliable environmentally-friendly tin-free plating solution for use with Press-Fit interconnections with negligible risk from metallic whisker growth. In comparison to Sn-based plating solutions, research has proven that LITESURF plating reduces the whisker risk by a factor greater than 1,600. In addition, pins using LITESURF plating technology, require up to 30% lower insertion forces. Other benefits of the LITESURF product process include carbon footprint reduction by up to 50% and the usage of nickel (Ni) is reduced by 80%. LITESURF pins can be used with all major PCB technologies and is compliant with Sn-reflow treatment.
Learn more by registering to download our whitepaper.
LITESURF TIN-FREE ELECTROPLATING FOR PRESS-FIT TECHNOLOGY: Environmentally safe solution for tin whisker growth prevention
TE Connectivity’s LITESURF plating technology offers ultra-low risk of whisker growth in automotive electronic components. After around four years of development and intense research, TE Connectivity’s Bi-based LITESURF plating now provides a reliable environmentally-friendly tin-free plating solution for use with Press-Fit interconnections with negligible risk from metallic whisker growth. In comparison to Sn-based plating solutions, research has proven that LITESURF plating reduces the whisker risk by a factor greater than 1,600. In addition, pins using LITESURF plating technology, require up to 30% lower insertion forces. Other benefits of the LITESURF product process include carbon footprint reduction by up to 50% and the usage of nickel (Ni) is reduced by 80%. LITESURF pins can be used with all major PCB technologies and is compliant with Sn-reflow treatment.
Learn more by registering to download our whitepaper.
