TE Is Enabling the Future of Defense Interceptor Missiles

Regardless of the type of missile, its range, and its intended target, each interceptor missile relies on various integrated systems to be ready to perform the moment a threat is detected. Each of these systems consists of a multitude of assemblies and subassemblies that work in harmony to help ensure the missile completes its mission.

The guidance processor unit (GPU), for example, is the heart of the missile that detects the incoming threat and directs the missile to its target. The GPU is connected to one or more seeker sensors that use radar, infrared imaging, or other technologies to locate the interceptor missile’s target. At the same time, the incoming missile may also be employing radar jammers and other countermeasures to thwart detection. The interceptor must therefore be equipped with multiple sensor options and be able to quickly switch from one option to the next to remain on target. Each of these sensors requires a separate electronic system that must perform flawlessly under extreme conditions.

Beyond the GPU and seeker sensors, several connectors are built into each of the other subassemblies, such as the inertial measurement unit, battery, aerodynamic maneuvering system, and attitude control system. That’s why choosing the right connectors is critical to the performance of the interceptor missile.

The type and size of connectors is one of the constraining elements in the defense interceptor missile’s design. Minimizing the size of the connectors, without compromising ruggedness, and taking a system architecture approach to design help make the most of the limited space inside the missile.

Pretty much every element in the design of an interceptor missile is subject to size, weight, and power (SWaP) analysis. Minimizing the SWaP requirements for each component helps maximize the missile’s range.

Most missile manufacturers implement solutions based on rectangular small-form factor connectors, including connectors that meet MIL-DTL 83513 and MIL-DTL-32139. These standards specify common connectors, define performance and testing requirements, and enable common design. TE Connectivity (TE) offers a broad range of Micro-D connectors that meet the MIL standards.

TE also offers a special class of connectors, which go beyond the performance of the MIL standard to include additional seal features, improved shielding, or different connector pin  arrangements. These connectors are capable of handling a mix of signal and power, which does not exist in the MIL standard.

TE’s Nanonics family of connectors is one size below the Micro-D connectors. Nanonics connectors are typically used to interconnect the various printed circuit boards (PCBs) found in the interceptor missile’s GPU, seeker sensors, and other subassemblies. Switching to a Nanonics connector can reduce the size and weight of a typical interconnect and enable more complex electronic designs to fit within the constrained environment of the missile.

Once you select the TE connector that best meets your needs, TE engineers can help you create optimal interconnect solutions.

TE’s strength is in providing all the building blocks needed to design and construct interconnects to your missile specs or deliver the complete cable assembly. Beginning with connectors as the foundation elements, we can design the interconnects between the electronic boxes that connect and control the missile’s guidance, sensors, and other critical systems. We provide the connectors at each end of the termination, the wires and cables between the connectors, the braiding, back shells, and sleeving to create a cable assembly designed to meet the harsh demands of military applications.

With an extensive portfolio of products, backed by knowledgeable engineers with experience in a broad range of industries, you can trust in TE as your source for connectors that meet or exceed MIL standards. Missile manufacturers and subcontractors count on TE can help ensure a homogenous design throughout the missile, from tip to tail.

• Interceptor missiles rely on mission-critical connectors in each subassembly to detect, track, and destroy incoming threats before they reach their targets.
• Minimizing SWaP requirements of connectors, without compromising ruggedness, helps maximize the available space inside the missile and its range.
• TE’s Micro-D and Nanonics connectors meet or exceed the performance of MIL-DTL-83513 and MIL-DTL-32139 standards to help missile manufacturers and subcontractors design optimal interconnect solutions.
• TE offers more than just products to help you connect point A with point B. TE engineers are available to help you find the best solutions for your project.