1-2141230-2
PCB Mount Header, Horizontal, Wire-to-Device, 3 Position, 23 mm [.905 in] Centerline, Fully Shrouded, Silver, Sealable, Orange, AMP+ HVP800
1-2141230-2
PCB Mount Header, Horizontal, Wire-to-Device, 3 Position, 23 mm [.905 in] Centerline, Fully Shrouded, Silver, Sealable, Orange, AMP+ HVP800
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- AMP+ HVP800
- TE Internal #: 1-2141230-2
- TE Internal Description: 3POS,PIN DIA 8.0,PIN HSG,ASSY,SLD
- All Low & Medium Power Header (99)
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Operating Temperature Range : -40 – 140 °C [ -40 – 284 °F ]
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Primary Product Color : Orange
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Operating Temperature (Max) (°C): 125, 80, 90, 130, 70, 100, 110, 120, 140, 105, 85
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Operating Temperature (Max) (°F): 185, 194, 284, 212, 221, 230, 248, 257, 266, 167, 158, 176
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Connector Shape : Rectangular
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Centerline (Pitch) : 23 mm [ .905 in ]
Documents
Product Drawings
- 3POS, PIN DIA 8.0, PIN HSG, ASSY, SLD GER_CD_2141230_F2.pdf German
CAD Files
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Download ECAD Model File
Download the free Library Loader to convert this file to your ECAD Tool. Learn more about the ECAD Model.
- 3D PDF 3D_CVM_CVM_1-2141230-2_D.pdf 3D
- Customer View Model ENG_CVM_CVM_1-2141230-2_D.2d_dxf.zip English
- ENG_CVM_CVM_1-2141230-2_D.3d_igs.zip English
- ENG_CVM_CVM_1-2141230-2_D.3d_stp.zip English
Product Specifications
- Application Specification ENG_SS_114-94153_C.pdf English
- Product Specification ENG_SS_108-94268_J.pdf English
- ENG_SS_108-94297_E2.pdf English
