1-2324271-5
LGA 4189, 2092 Position, Surface Mount - Solder Ball, Grid Spacing .9906 x .8585 mm [.039 x .0338 in], Board Mount, LGA Sockets
1-2324271-5
LGA 4189, 2092 Position, Surface Mount - Solder Ball, Grid Spacing .9906 x .8585 mm [.039 x .0338 in], Board Mount, LGA Sockets
- TE Internal #: 1-2324271-5
- TE Internal Description: RIGHT SEGMENT LGA4189-5 SOCKETP5 FOR ODM
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IC Socket Type : LGA 4189
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Number of Positions : 2092
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Contact Mating Area Plating Material Thickness (µin): 30
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Termination Method to PCB : Surface Mount - Solder Ball
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Grid Spacing : .9906 x .8585 mm [ .039 x .0338 in ]
Documents
Product Drawings
- CUSTOMER DRAWING FOR LGA4189,SOCKET P4 ENG_CD_2324271_A.pdf English
CAD Files
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Download ECAD Model File
Download the free Library Loader to convert this file to your ECAD Tool. Learn more about the ECAD Model.
- 3D PDF 3D_CVM_CVM_1-2324271-5_A.pdf 3D
- Customer View Model ENG_CVM_CVM_1-2324271-5_A.2d_dxf.zip English
- ENG_CVM_CVM_1-2324271-5_A.3d_igs.zip English
- ENG_CVM_CVM_1-2324271-5_A.3d_stp.zip English
Datasheets & Catalog Pages
- LGA 4189 Socket and Hardware ENG_DS_1-1773982-4-lga_4189_flyer_en_1020.pdf English
- 1-1773982-5-lga_4189_flyer_cn ENG_DS_1-1773982-5-lga_4189_flyer_cn_1020.pdf English
Product Specifications
- Application Specification ENG_SS_114-115024_E.pdf English
- Product Specification ENG_SS_108-115149_A.pdf English
- JPN_SS_108-5118_K.tif Japanese
- JPN_SS_108-5118_K.pdf Japanese
Agency Approvals
- UL Report ENG_AAD_UL_E28476_20041208_B.pdf English
