Please review product documents or contact us for the latest agency approval information.
Configuration Features
-
PCB Mount Orientation :
Vertical
-
Number of Positions :
1
Electrical Characteristics
-
Insulation Resistance (MΩ):
1000
-
Contact Resistance (mΩ):
10
Body Features
-
Frame Style :
Film Carrier
-
Connector Profile :
Zero
Contact Features
-
Contact Type :
Socket
-
IC Socket Type :
DIP
-
Contact Base Material :
Beryllium Copper
-
Mating Contact Type :
Four-Fingered
-
Contact Fabrication :
Solid
-
Contact Mating Area Plating Material :
Gold (Au)
-
Contact Mating Area Plating Material Thickness (µin):
25
-
Contact Current Rating (Max) (A):
3
Termination Features
-
Termination Post & Tail Length :
3.18 mm [ .125 in ]
-
Termination Method to PCB :
Through Hole - Solder
Housing Features
-
Centerline (Pitch) :
2.54 mm [ .1 in ]
Dimensions
-
Profile Height from PCB :
0 mm [ 0 in ]
-
Row-to-Row Spacing :
10.16 mm [ .4 in ]
Packaging Features
-
Packaging Quantity :
5000
-
Packaging Method :
Reel
