2013289-2

Active

Double Data Rate (DDR) 3, Stack Height 5.2 mm [.205 in], Right Angle Module Orientation, 204 Position, .6 mm [.024 in] Centerline, SO DIMM Sockets

2013289-2

Active

Double Data Rate (DDR) 3, Stack Height 5.2 mm [.205 in], Right Angle Module Orientation, 204 Position, .6 mm [.024 in] Centerline, SO DIMM Sockets

TE Internal #: 2013289-2
TE Internal Description: SEMI-HARD TRAY DDR3 204P 5.2H STD Au0.25

Packaging Method : Semi-Hard Tray Assembly
Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]
Ejector Type : Locking
Stack Height : 5.2 mm [ .205 in ]

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Compatible Parts & Tooling

Documents

Product Drawings

DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 5.2mm HEIGHT STANDARD TYPE ENG_CD_2013289_C.pdf English

CAD Files

Download ECAD Model File
Download the free Library Loader to convert this file to your ECAD Tool. Learn more about the ECAD Model.
3D PDF 3D_CVM_CVM_2013289-2_B.pdf 3D
Customer View Model ENG_CVM_CVM_2013289-2_B.2d_dxf.zip English
ENG_CVM_CVM_2013289-2_B.3d_igs.zip English
ENG_CVM_CVM_2013289-2_B.3d_stp.zip English

Datasheets & Catalog Pages

DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 ENG_DS_6-1773454-7_0511.pdf English
6-1773457-3_DDR3_DIMM_SOCKETS CHI_DS_6-1773457-3_DDR3_DIMM_SOCKETS_TC_0411.pdf

Product Specifications

Product Specification ENG_SS_108-78493_B.pdf English

Product Change Notification

View Product Change Notification Login required to access product change notifications

Features

Please review product documents or contact us for the latest agency approval information.

Please Note: Use the Product Drawing for all design activity.

Product Type Features

Connector & Contact Terminates To : Printed Circuit Board
Connector System : Cable-to-Board
DRAM Type : Double Data Rate (DDR) 3

Configuration Features

Number of Keys : 1
Number of Positions : 204
Number of Rows : 2
Number of Bays : 2
Module Orientation : Right Angle

Electrical Characteristics

DRAM Voltage (V): 1.5

Signal Characteristics

SGRAM Voltage (V): 1.5

Body Features

Ejector Type : Locking
Module Key Type : SGRAM
Connector Profile : Standard
Ejector Location : Both Ends
Latch Material : Stainless Steel
Latch Plating Material : Tin

Contact Features

Memory Socket Type : Memory Card
Contact Mating Area Plating Material Thickness : .254 µm [ 10 µin ]
Contact Base Material : Copper Alloy
PCB Contact Termination Area Plating Material : Gold
Contact Mating Area Plating Material : Gold
Contact Current Rating (Max) (A): .5

Termination Features

Insertion Style : Cam-In

Mechanical Attachment

PCB Mount Retention Type : Solder Peg
Connector Mounting Type : Board Mount
Mating Alignment Type : Standard Keying
PCB Mount Retention : With

Housing Features

Housing Material : High Temperature Thermoplastic
Centerline (Pitch) : .6 mm [ .024 in ]
Housing Color : Black

Dimensions

Stack Height : 5.2 mm [ .205 in ]
Row-to-Row Spacing : 8.2 mm [ .322 in ]

Usage Conditions

Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Operation/Application

Circuit Application : Power

Industry Standards

UL Flammability Rating : UL 94V-0

Packaging Features

Packaging Method : Semi-Hard Tray Assembly
Packaging Quantity : 20

2013289-2

Double Data Rate (DDR) 3, Stack Height 5.2 mm [.205 in], Right Angle Module Orientation, 204 Position, .6 mm [.024 in] Centerline, SO DIMM Sockets

2013289-2

Double Data Rate (DDR) 3, Stack Height 5.2 mm [.205 in], Right Angle Module Orientation, 204 Position, .6 mm [.024 in] Centerline, SO DIMM Sockets

Packaging Method : Semi-Hard Tray Assembly

Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Ejector Type : Locking

Stack Height : 5.2 mm [ .205 in ]

Documents

Product Drawings

CAD Files

Datasheets & Catalog Pages

Product Specifications

Product Change Notification

Features

Product Type Features

Connector & Contact Terminates To : Printed Circuit Board

Connector System : Cable-to-Board

DRAM Type : Double Data Rate (DDR) 3

Configuration Features

Number of Keys : 1

Number of Positions : 204

Number of Rows : 2

Number of Bays : 2

Module Orientation : Right Angle

Electrical Characteristics

DRAM Voltage (V): 1.5

Signal Characteristics

SGRAM Voltage (V): 1.5

Body Features

Ejector Type : Locking

Module Key Type : SGRAM

Connector Profile : Standard

Ejector Location : Both Ends

Latch Material : Stainless Steel

Latch Plating Material : Tin

Contact Features

Memory Socket Type : Memory Card

Contact Mating Area Plating Material Thickness : .254 µm [ 10 µin ]

Contact Base Material : Copper Alloy

PCB Contact Termination Area Plating Material : Gold

Contact Mating Area Plating Material : Gold

Contact Current Rating (Max) (A): .5

Termination Features

Insertion Style : Cam-In

Mechanical Attachment

PCB Mount Retention Type : Solder Peg

Connector Mounting Type : Board Mount

Mating Alignment Type : Standard Keying

PCB Mount Retention : With

Housing Features

Housing Material : High Temperature Thermoplastic

Centerline (Pitch) : .6 mm [ .024 in ]

Housing Color : Black

Dimensions

Stack Height : 5.2 mm [ .205 in ]

Row-to-Row Spacing : 8.2 mm [ .322 in ]

Usage Conditions

Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Operation/Application

Circuit Application : Power

Industry Standards

UL Flammability Rating : UL 94V-0

Packaging Features

Packaging Method : Semi-Hard Tray Assembly

Packaging Quantity : 20

Product Compliance

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