2013290-2

Active

Double Data Rate (DDR) 3, Stack Height 5.2 mm [.205 in], Right Angle Module Orientation, 204 Position, RAYCHEM RVS, SO DIMM Sockets

2013290-2

Active

Double Data Rate (DDR) 3, Stack Height 5.2 mm [.205 in], Right Angle Module Orientation, 204 Position, RAYCHEM RVS, SO DIMM Sockets

- RAYCHEM RVS

TE Internal #: 2013290-2
TE Internal Description: SEMI-HARD TRAY DDR3 204P 5.2H RVS Au0.25

DRAM Type : Double Data Rate (DDR) 3
Stack Height : 5.2 mm [ .205 in ]
Module Orientation : Right Angle
Number of Positions : 204
Centerline (Pitch) : .6 mm [ .024 in ]

See All Features

More Less

Compatible Parts & Tooling

Documents

Product Drawings

DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 5.2mm HEIGHT REVERSE TYPE ENG_CD_2013290_C1_baseFilename.pdf English

CAD Files

Download ECAD Model File
Download the free Library Loader to convert this file to your ECAD Tool. Learn more about the ECAD Model.
3D PDF 3D_CVM_CVM_2013290-2_B_c-2013290-2-b-3d.pdf 3D
Customer View Model ENG_CVM_CVM_2013290-2_B_c-2013290-2-b.2d_dxf.zip English
ENG_CVM_CVM_2013290-2_B_c-2013290-2-b.3d_igs.zip English
ENG_CVM_CVM_2013290-2_B_c-2013290-2-b.3d_stp.zip English

Datasheets & Catalog Pages

DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 ENG_DS_6-1773454-7_0511.pdf English

Product Specifications

Product Specification ENG_SS_108-78493_B.pdf English

Product Change Notification

View Product Change Notification Login required to access product change notifications

Features

Please review product documents or contact us for the latest agency approval information.

Please Note: Use the Product Drawing for all design activity.

Product Type Features

Connector System : Cable-to-Board
Connector & Contact Terminates To : Printed Circuit Board
DRAM Type : Double Data Rate (DDR) 3

Configuration Features

Number of Rows : 2
Number of Keys : 1
Number of Bays : 2
Module Orientation : Right Angle
Number of Positions : 204

Housing Features

Housing Color : Black
Housing Material : High Temperature Thermoplastic
Centerline (Pitch) : .6 mm [ .024 in ]

Body Features

Ejector Location : Both Ends
Ejector Type : Locking
Module Key Type : SGRAM
Latch Material : Stainless Steel
Latch Plating Material : Tin
Connector Profile : Reverse

Contact Features

PCB Contact Termination Area Plating Material : Gold
Contact Base Material : Copper Alloy
Memory Socket Type : Memory Card
Contact Current Rating (Max) (A): .5
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : .254 µm [ 10 µin ]

Packaging Features

Packaging Quantity : 20
Packaging Method : Semi-Hard Tray Assembly

Signal Characteristics

SGRAM Voltage (V): 1.5

Mechanical Attachment

PCB Mount Retention : With
Mating Alignment Type : Reverse Keying
PCB Mount Retention Type : Solder Peg
Connector Mounting Type : Board Mount

Termination Features

Termination Method to PCB : Surface Mount
Insertion Style : Cam-In

Industry Standards

UL Flammability Rating : UL 94V-0

Electrical Characteristics

DRAM Voltage (V): 1.5

Dimensions

Stack Height : 5.2 mm [ .205 in ]
Row-to-Row Spacing : 8.2 mm [ .322 in ]

Usage Conditions

Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Operation/Application

Circuit Application : Power

Other

EU RoHS Compliance : Compliant
EU ELV Compliance : Compliant

2013290-2

Double Data Rate (DDR) 3, Stack Height 5.2 mm [.205 in], Right Angle Module Orientation, 204 Position, RAYCHEM RVS, SO DIMM Sockets

2013290-2

Double Data Rate (DDR) 3, Stack Height 5.2 mm [.205 in], Right Angle Module Orientation, 204 Position, RAYCHEM RVS, SO DIMM Sockets

DRAM Type : Double Data Rate (DDR) 3

Stack Height : 5.2 mm [ .205 in ]

Module Orientation : Right Angle

Number of Positions : 204

Centerline (Pitch) : .6 mm [ .024 in ]

Documents

Product Drawings

CAD Files

Datasheets & Catalog Pages

Product Specifications

Product Change Notification

Features

Product Type Features

Connector System : Cable-to-Board

Connector & Contact Terminates To : Printed Circuit Board

DRAM Type : Double Data Rate (DDR) 3

Configuration Features

Number of Rows : 2

Number of Keys : 1

Number of Bays : 2

Module Orientation : Right Angle

Number of Positions : 204

Housing Features

Housing Color : Black

Housing Material : High Temperature Thermoplastic

Centerline (Pitch) : .6 mm [ .024 in ]

Body Features

Ejector Location : Both Ends

Ejector Type : Locking

Module Key Type : SGRAM

Latch Material : Stainless Steel

Latch Plating Material : Tin

Connector Profile : Reverse

Contact Features

PCB Contact Termination Area Plating Material : Gold

Contact Base Material : Copper Alloy

Memory Socket Type : Memory Card

Contact Current Rating (Max) (A): .5

Contact Mating Area Plating Material : Gold

Contact Mating Area Plating Material Thickness : .254 µm [ 10 µin ]

Packaging Features

Packaging Quantity : 20

Packaging Method : Semi-Hard Tray Assembly

Signal Characteristics

SGRAM Voltage (V): 1.5

Mechanical Attachment

PCB Mount Retention : With

Mating Alignment Type : Reverse Keying

PCB Mount Retention Type : Solder Peg

Connector Mounting Type : Board Mount

Termination Features

Termination Method to PCB : Surface Mount

Insertion Style : Cam-In

Industry Standards

UL Flammability Rating : UL 94V-0

Electrical Characteristics

DRAM Voltage (V): 1.5

Dimensions

Stack Height : 5.2 mm [ .205 in ]

Row-to-Row Spacing : 8.2 mm [ .322 in ]

Usage Conditions

Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Operation/Application

Circuit Application : Power

Other

EU RoHS Compliance : Compliant

EU ELV Compliance : Compliant

Product Compliance