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2013311-3

Active

Double Data Rate (DDR) 3, 9.2 mm [.362 in] Stack Height, Right Angle Module Orientation, 204 Position, RAYCHEM RVS, SO DIMM Sockets

2013311-3

Active

Double Data Rate (DDR) 3, 9.2 mm [.362 in] Stack Height, Right Angle Module Orientation, 204 Position, RAYCHEM RVS, SO DIMM Sockets

- RAYCHEM RVS

TE Internal #: 2013311-3
TE Internal Description: SEMI-HARD TRAY DDR3 204P 9.2H RVS Au0.76

DRAM Type : Double Data Rate (DDR) 3
Stack Height : 9.2 mm [ .362 in ]
Module Orientation : Right Angle
Number of Positions : 204
Centerline (Pitch) : .6 mm [ .024 in ]

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Compatible Parts & Tooling

Documents

CAD Files

Download ECAD Model File
Download the free Library Loader to convert this file to your ECAD Tool. Learn more about the ECAD Model.
3D PDF 3D_CVM_CVM_2013311-3_C.pdf 3D
Customer View Model ENG_CVM_CVM_2013311-3_C.2d_dxf.zip English
ENG_CVM_CVM_2013311-3_C.3d_igs.zip English
ENG_CVM_CVM_2013311-3_C.3d_stp.zip English

Product Specifications

Product Specification ENG_SS_108-78493_B.pdf English

Product Change Notification

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Features

Please review product documents or contact us for the latest agency approval information.

Product Type Features

Connector System : Cable-to-Board
Connector & Contact Terminates To : Printed Circuit Board
DRAM Type : Double Data Rate (DDR) 3

Configuration Features

Number of Rows : 2
Number of Keys : 1
Number of Bays : 2
Module Orientation : Right Angle
Number of Positions : 204

Electrical Characteristics

DRAM Voltage (V): 1.5

Signal Characteristics

SGRAM Voltage (V): 1.5

Body Features

Ejector Location : Both Ends
Ejector Type : Locking
Module Key Type : SGRAM
Latch Material : Stainless Steel
Latch Plating Material : Tin
Connector Profile : Reverse

Contact Features

PCB Contact Termination Area Plating Material : Gold
Contact Base Material : Copper Alloy
Memory Socket Type : Memory Card
Contact Current Rating (Max) (A): .5
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : .76 µm [ 30 µin ]

Termination Features

Termination Method to PCB : Surface Mount
Insertion Style : Cam-In

Mechanical Attachment

PCB Mount Retention : With
Mating Alignment Type : Reverse Keying
PCB Mount Retention Type : Solder Peg
Connector Mounting Type : Board Mount

Housing Features

Housing Color : Black
Housing Material : High Temperature Thermoplastic
Centerline (Pitch) : .6 mm [ .024 in ]

Dimensions

Stack Height : 9.2 mm [ .362 in ]
Row-to-Row Spacing : 8.2 mm [ .322 in ]

Usage Conditions

Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Operation/Application

Circuit Application : Power

Industry Standards

UL Flammability Rating : UL 94V-0

Packaging Features

Packaging Quantity : 20
Packaging Method : Semi-Hard Tray Assembly

2013311-3

Double Data Rate (DDR) 3, 9.2 mm [.362 in] Stack Height, Right Angle Module Orientation, 204 Position, RAYCHEM RVS, SO DIMM Sockets

2013311-3

Double Data Rate (DDR) 3, 9.2 mm [.362 in] Stack Height, Right Angle Module Orientation, 204 Position, RAYCHEM RVS, SO DIMM Sockets

DRAM Type : Double Data Rate (DDR) 3

Stack Height : 9.2 mm [ .362 in ]

Module Orientation : Right Angle

Number of Positions : 204

Centerline (Pitch) : .6 mm [ .024 in ]

Documents

CAD Files

Product Specifications

Product Change Notification

Features

Product Type Features

Connector System : Cable-to-Board

Connector & Contact Terminates To : Printed Circuit Board

DRAM Type : Double Data Rate (DDR) 3

Configuration Features

Number of Rows : 2

Number of Keys : 1

Number of Bays : 2

Module Orientation : Right Angle

Number of Positions : 204

Electrical Characteristics

DRAM Voltage (V): 1.5

Signal Characteristics

SGRAM Voltage (V): 1.5

Body Features

Ejector Location : Both Ends

Ejector Type : Locking

Module Key Type : SGRAM

Latch Material : Stainless Steel

Latch Plating Material : Tin

Connector Profile : Reverse

Contact Features

PCB Contact Termination Area Plating Material : Gold

Contact Base Material : Copper Alloy

Memory Socket Type : Memory Card

Contact Current Rating (Max) (A): .5

Contact Mating Area Plating Material : Gold (Au)

Contact Mating Area Plating Material Thickness : .76 µm [ 30 µin ]

Termination Features

Termination Method to PCB : Surface Mount

Insertion Style : Cam-In

Mechanical Attachment

PCB Mount Retention : With

Mating Alignment Type : Reverse Keying

PCB Mount Retention Type : Solder Peg

Connector Mounting Type : Board Mount

Housing Features

Housing Color : Black

Housing Material : High Temperature Thermoplastic

Centerline (Pitch) : .6 mm [ .024 in ]

Dimensions

Stack Height : 9.2 mm [ .362 in ]

Row-to-Row Spacing : 8.2 mm [ .322 in ]

Usage Conditions

Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Operation/Application

Circuit Application : Power

Industry Standards

UL Flammability Rating : UL 94V-0

Packaging Features

Packaging Quantity : 20

Packaging Method : Semi-Hard Tray Assembly

Product Compliance