Please review product documents or contact us for the latest agency approval information.
Contact Features
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Contact Type :
Socket
-
IC Socket Type :
DIP
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Contact Base Material :
Beryllium Copper
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Mating Contact Type :
Four-Fingered
-
Contact Fabrication :
Solid
-
Contact Mating Area Plating Material :
Tin-Lead
-
Contact Mating Area Plating Material Thickness (µin):
25
-
Contact Current Rating (Max) (A):
3
Configuration Features
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PCB Mount Orientation :
Vertical
-
Number of Positions :
8
Body Features
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Frame Style :
Film Carrier
-
Connector Profile :
Zero
Dimensions
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Profile Height from PCB :
0 mm [ 0 in ]
-
Row-to-Row Spacing :
7.62 mm [ .3 in ]
Packaging Features
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Packaging Quantity :
5000
-
Packaging Method :
Reel
Housing Features
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Centerline (Pitch) :
2.54 mm [ .1 in ]
Termination Features
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Termination Post & Tail Length :
3.18 mm [ .125 in ]
-
Termination Method to PCB :
Through Hole - Solder
Electrical Characteristics
-
Insulation Resistance (MΩ):
1000
-
Contact Resistance (mΩ):
10
Other
-
EU ELV Compliance :
Not Compliant
