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Features

Please review product documents or contact us for the latest agency approval information.  

Packaging Features

  • Packaging Method  Bag, Loose Piece

  • Packaging Quantity  2000

Operation/Application

  • Solder Process Feature  None

  • Circuit Application  Power & Signal, Signal

Contact Features

  • Contact Spring Plating Thickness  .762 µm [ 30 µin ]

  • Contact Spring Plating Material  Gold

  • Contact Mating Area Plating Material Thickness  30 µm [ 30 µin ]

  • Contact Base Material  Beryllium Copper

  • Contact Mating Area Plating Material  Gold

  • Contact Current Rating (Max) (A) 3

Termination Features

  • Termination Method to PCB  Through Hole - Press-Fit

  • Termination Method to Wire & Cable  Solder

  • Insertion Method  Hand/Semi-Automatic

Other

  • Spring Material  Beryllium Copper

  • EU RoHS Compliance  Compliant

  • EU ELV Compliance  Compliant

Product Type Features

  • Connector & Contact Terminates To  Printed Circuit Board

  • Socket Sleeve Style  Knockout Bottom

  • Connector System  Cable-to-Board

  • Sealable  No

Body Features

  • Sleeve Material  Copper

  • Sleeve Plating Material  Gold Flash over Nickel, Tin

Configuration Features

  • Compatible With Wire & Cable Type  Discrete Wire

Dimensions

  • PCB Thickness (Recommended)  .79 – 3.18 mm [ .031 – .125 in ]

  • Socket Length (mm) 3.61, 4.52

  • Socket Length (in) .178, .142

  • PCB Hole Diameter  1.04 mm [ .041 in ]

  • Wire Size (AWG) 28 – 25

  • Wire Size (mm²) .081 – .162

  • Mating Pin Diameter Range  .33 – .51 mm [ .013 – .02 in ]

Usage Conditions

  • Operating Temperature Range  -65 – 125 °C [ -85 – 257 °F ]

Reference Number

  • TE Internal Number CAT-377-MSSKB3

Related Materials
No documentation available.