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Miniature Spring Sockets: Open Bottom, Beryllium Copper, 7.5A

Miniature Spring Sockets: Open Bottom, Beryllium Copper, 7.5A-CAT-377-MSSOB75
These Miniature spring sockets assemblies are made of beryllium copper with open bottom sleeve style and have a contact current rating of 7.5 AMP. Available in operating temperature range of -65 – 125 DEGC and, rated for power & signal circuit applications.
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Product Features

  • Socket Length (mm): 6.45, 7.32

  • Socket Length (in): .254, .288

  • PCB Hole Diameter (mm): 2.26, 2.56

  • PCB Hole Diameter (in): .089, .101

  • Socket Sleeve Style : Open Bottom

  • Wire Size (AWG): 17 – 15, 25 – 19, 16 – 14, 18 – 17

  • Wire Size (mm²): 1.04 – 1.65, .162 – .653, .823 – 1.04, 1.31 – 2.08

Available from

LADD Inc
Features

Please review product documents or contact us for the latest agency approval information.  

Product Type Features

  • Connector & Contact Terminates To  Printed Circuit Board

  • Socket Sleeve Style  Open Bottom

  • Connector System  Cable-to-Board

  • Sealable  No

Configuration Features

  • Compatible With Wire & Cable Type  Discrete Wire

Body Features

  • Sleeve Material  Copper

  • Sleeve Plating Material  Gold, Gold Flash over Nickel, Tin

Contact Features

  • Contact Mating Area Plating Material Thickness (µm) 30

  • Contact Spring Plating Thickness (µm) .762, 2.03, 2.54

  • Contact Spring Plating Thickness (µin) 30

  • Contact Spring Plating Material  Gold, Tin

  • Contact Base Material  Beryllium Copper

  • Contact Mating Area Plating Material Thickness  30 µm [ 30 µin ]

  • Contact Current Rating (Max) (A) 7.5

Termination Features

  • Insertion Method  Hand/Semi-Automatic

  • Termination Method to PCB  Through Hole - Press-Fit

  • Termination Method to Wire & Cable  Solder

Dimensions

  • PCB Thickness (Recommended)  .79 – 3.18 mm [ .031 – .125 in ]

  • Socket Length (mm) 6.45, 7.32

  • Socket Length (in) .254, .288

  • PCB Hole Diameter (mm) 2.26, 2.56

  • PCB Hole Diameter (in) .089, .101

  • Wire Size (AWG) 17 – 15, 25 – 19, 16 – 14, 18 – 17

  • Wire Size (mm²) 1.04 – 1.65, .162 – .653, .823 – 1.04, 1.31 – 2.08

  • Mating Pin Diameter Range (mm) 1.42 – 1.65, 1.07 – 1.24, 1.27 – 1.45, .46 – 1.02

  • Mating Pin Diameter Range (in) .056 – .065, .018 – .04, .042 – .049, .05 – .057

Usage Conditions

  • Operating Temperature Range  -65 – 125 °C [ -85 – 257 °F ]

Operation/Application

  • Solder Process Feature  None

  • Circuit Application  Power & Signal

Packaging Features

  • Packaging Method  Bag, Loose Piece

  • Packaging Quantity  2000

Other

  • Spring Material  Beryllium Copper

Reference Number

  • TE Internal Number CAT-377-MSSOB75

Related Materials
No documentation available.