DDR2 SO DIMM Sockets

Please review product documents or contact us for the latest agency approval information.  

• Connector System  Cable-to-Board

• Connector & Contact Terminates To  Printed Circuit Board

• DRAM Type  Double Data Rate (DDR), Double Data Rate (DDR) 2

• Number of Keys  1

• Number of Bays  2

• Number of Rows  2

• Module Orientation  Right Angle

• Number of Positions  200

• DRAM Voltage (V) 1.8, 2.5

• SGRAM Voltage (V) 1.8, 2.5

• Latch Plating Material  Tin

• Retention Post Location  Center

• Latch Material  Stainless Steel

• Ejector Type  Locking

• Ejector Location  Both Ends

• Module Key Type  Offset Left, SGRAM

• Retention Post Material  Copper Alloy

• Connector Profile  Low, Standard, Ultra High

• Contact Underplating Material  Nickel

• Contact Current Rating (Max) (A) .5

• Memory Socket Type  Memory Card

• Contact Base Material  Copper Alloy

• PCB Contact Termination Area Plating Material  Gold, Gold Flash

• Contact Mating Area Plating Material  Gold (Au), Gold Flash

• Contact Mating Area Plating Material Thickness  .76 µm [ 30 µin ]

• Termination Method to PCB  Surface Mount

• Insertion Style  Cam-In

• PCB Mount Retention Type  Solder Peg, Solder Tail

• PCB Mount Retention  With

• Mating Alignment Type  Reverse Keying, Standard Keying

• Connector Mounting Type  Board Mount

• Housing Material  High Temperature Thermoplastic, LCP (Liquid Crystal Polymer)

• Housing Color  Black, Gray

• Centerline (Pitch)  .6 mm [ .024 in ]

• Stack Height (mm) 4, 4.6, 5.2, 6.5, 8, 9.2

• Stack Height (in) .157, .18, .205, .256, .315, .362

• Row-to-Row Spacing (mm) 5.6, 5.8, 6.2

• Row-to-Row Spacing (in) .22, .228, .244

• Operating Temperature Range  -55 – 85 °C [ -67 – 185 °F ]

• Circuit Application  Power

• UL Flammability Rating  UL 94V-0

• Packaging Quantity  16, 20, 150, 200

• Packaging Method  Box, Hard Tray, Reel, Semi-Hard Tray Assembly, Tape & Reel, Tray