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DDR2 SO DIMM Sockets

DDR2 SO DIMM Sockets-CAT-D3301-SO1339
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Product Features

  • Packaging Method : Box, Tray, Semi-Hard Tray Assembly, Hard Tray, Tape & Reel, Reel

  • Operating Temperature Range (°C): -55 – 85, -55 – 105

  • Operating Temperature Range (°F): -67 – 185, -67 – 221

  • Contact Mating Area Plating Material Thickness (µm): .254, .76

  • Contact Mating Area Plating Material Thickness (µin): 10, 30

  • Contact Current Rating (Max) (A): .5

Available from

LADD Inc
Features

Please review product documents or contact us for the latest agency approval information.  

Product Type Features

  • Connector System  Cable-to-Board

  • Connector & Contact Terminates To  Printed Circuit Board

  • DRAM Type  Double Data Rate (DDR), Double Data Rate (DDR) 2

Configuration Features

  • Number of Bays  2

  • Module Orientation  Right Angle, Vertical

  • Number of Positions  200

  • Number of Rows  2

  • Number of Keys  1

Electrical Characteristics

  • DRAM Voltage (V) 1.8, 2.5

Signal Characteristics

  • SGRAM Voltage (V) 1.8, 2.5

Body Features

  • Ejector Type  Locking, Standard

  • Retention Post Material  Copper Alloy

  • Retention Post Location  Both Ends, Center

  • Connector Profile  Standard, Reverse, Low, Ultra High

  • Module Key Type  SGRAM, Offset Right, Offset Left

  • Ejector Location  Both Ends

  • Latch Material  Stainless Steel, High Temperature Thermoplastic

  • Latch Plating Material  Tin

Contact Features

  • Contact Mating Area Plating Material Thickness (µm) .254, .76

  • Contact Mating Area Plating Material Thickness (µin) 10, 30

  • Contact Current Rating (Max) (A) .5

  • Contact Base Material  Copper Alloy

  • Memory Socket Type  Memory Card

  • PCB Contact Termination Area Plating Material  Gold Flash, Tin, Gold

  • Contact Mating Area Plating Material  Gold, Gold Flash

  • Contact Underplating Material  Nickel

Termination Features

  • Insertion Style  Cam-In

Mechanical Attachment

  • Mating Alignment Type  Standard Keying, Reverse Keying

  • PCB Mount Retention  With

  • PCB Mount Retention Type  Solder Peg, Solder Tail

  • Connector Mounting Type  Board Mount

Housing Features

  • Housing Material  High Temperature Thermoplastic, Thermoplastic, LCP (Liquid Crystal Polymer)

  • Housing Color  Black, Gray

  • Centerline (Pitch)  .6 mm [ .024 in ]

Dimensions

  • Row-to-Row Spacing (mm) 5.6, 5.8, 6.2, 7.6, 8.6

  • Row-to-Row Spacing (in) .22, .228, .244, .299, .338

  • Stack Height (mm) 4, 4.6, 5.2, 6.5, 8, 9.2

  • Stack Height (in) .157, .18, .205, .256, .315, .362

Usage Conditions

  • Operating Temperature Range (°C) -55 – 85, -55 – 105

  • Operating Temperature Range (°F) -67 – 185, -67 – 221

Operation/Application

  • Circuit Application  Power

Industry Standards

  • UL Flammability Rating  UL 94V-0

Packaging Features

  • Packaging Method  Box, Tray, Semi-Hard Tray Assembly, Hard Tray, Tape & Reel, Reel

  • Packaging Quantity  16, 20, 24, 150, 200

Reference Number

  • TE Internal Number CAT-D3301-SO1339

Related Materials
No documentation available.