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Features

Please review product documents or contact us for the latest agency approval information.  

Configuration Features

  • Number of Rows  2

  • Number of Keys  1

  • Number of Bays  2

  • Module Orientation  Right Angle, Vertical

  • Number of Positions  200

Body Features

  • Retention Post Location  Center, Both Ends

  • Ejector Location  Both Ends

  • Module Key Type  SGRAM, Offset Left, Offset Right

  • Latch Material  Stainless Steel, High Temperature Thermoplastic

  • Ejector Type  Locking, Standard

  • Latch Plating Material  Tin

  • Retention Post Material  Copper Alloy

  • Connector Profile  Ultra High, Low, Standard, Reverse

Signal Characteristics

  • SGRAM Voltage (V) 2.5, 1.8

Mechanical Attachment

  • Connector Mounting Type  Board Mount

  • Mating Alignment Type  Reverse Keying, Standard Keying

  • PCB Mount Retention Type  Solder Peg, Solder Tail

  • PCB Mount Retention  With

Termination Features

  • Termination Method to PCB  Surface Mount

  • Insertion Style  Cam-In

Housing Features

  • Housing Material  LCP (Liquid Crystal Polymer), Thermoplastic, High Temperature Thermoplastic

  • Housing Color  Gray, Black

  • Centerline (Pitch)  .6 mm [ .024 in ]

Product Type Features

  • Connector System  Cable-to-Board

  • Connector & Contact Terminates To  Printed Circuit Board

  • DRAM Type  Double Data Rate (DDR), Double Data Rate (DDR) 2

Packaging Features

  • Packaging Quantity  200, 20, 150, 24, 16

  • Packaging Method  Tape & Reel, Hard Tray, Box, Tray, Reel, Semi-Hard Tray Assembly

Industry Standards

  • UL Flammability Rating  UL 94V-0

Contact Features

  • Memory Socket Type  Memory Card

  • Contact Current Rating (Max) (A) .5

  • Contact Base Material  Copper Alloy

  • PCB Contact Termination Area Plating Material  Gold Flash, Gold, Tin

  • Contact Underplating Material  Nickel

  • Contact Mating Area Plating Material  Gold Flash, Gold

  • Contact Mating Area Plating Material Thickness (µm) .254, .76

  • Contact Mating Area Plating Material Thickness (µin) 30, 10

Electrical Characteristics

  • DRAM Voltage (V) 2.5, 1.8

Dimensions

  • Stack Height (mm) 9.2, 4, 5.2, 4.6, 8, 6.5

  • Stack Height (in) .205, .157, .315, .362, .256, .18

  • Row-to-Row Spacing (mm) 6.2, 5.6, 8.6, 5.8, 7.6

  • Row-to-Row Spacing (in) .338, .244, .22, .299, .228

Usage Conditions

  • Operating Temperature Range  -55 – 85 °C [ -67 – 185 °F ]

Operation/Application

  • Circuit Application  Power

Other

  • EU RoHS Compliance  Compliant

  • EU ELV Compliance  Compliant

Reference Number

  • TE Internal Number CAT-D3301-SO1339

Related Materials
No documentation available.