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DDR3 DIMM Sockets

DDR3 DIMM Sockets-CAT-D3303-SO1399
DDR3 DIMM Sockets are designed to JEDEC industry standards. They are available with vertical and right angle orientations and through hole and surface mount configurations. DDR3 DIMM Socket applications include servers, notebook PCs, and communications equipment.
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Product Features

  • DRAM Type : Double Data Rate (DDR) 3

  • Connector System : Board-to-Board

  • Number of Positions : 240

  • Termination Method to PCB : Surface Mount, Through Hole - Solder, Through Hole - Press-Fit

  • Module Orientation : Vertical

Available from

LADD Inc
Overview

Product Features

DDR3 Memory Sockets

  • Designed to accept standard JEDEC memory modules
  • Low resistance vertical through-hole socket available
  • SO DIMM's are offered in several stacking heights to maximize board space
  • Vertical through-hole sockets available in three tail lengths to accommodate most board thicknesses

168

Memory module pin count

The dual inline memory module (DIMM) is a memory module with 168 pins. DIMMs are commonly used today and support 64-bit transfer. They have been the predominant type of memory module since Intel P5-based Pentium processors began to gain market share.

Quick Reference Guide
DDR3 DIMM Sockets (English)

TE's DIMM sockets address interconnect requirements across server, communications, and notebook platforms. This product portfolio is designed around JEDEC industry standards. Sockets are offered with a variety of features designed to meet high speed data applications where peak performance is required.

Product Options

  • DDR3 DIMM Vertical Through Hole
  • DDR3 DIMM Vertical Surface Mount
  • DDR3 DIMM Right Angle Surface Mount
  • Mini DIMM Right Angle Surface Mount

Select Applications

DDR3 Memory Sockets

  • Notebook PC's
  • Desktop PC's
  • Communications equipment
  • Servers 

Application

Enhanced Ultraportables

Smaller devices require smaller components. TE’s low-profile solutions free up more space on a circuit board while delivering stability and power, allowing the smallest laptops to pack serious capability.

Product Group

SO DIMM Sockets

TE's memory sockets are designed for JEDEC SO DIMMs for the latest DDR2 and DDR3.

Product Group

DDR4 Memory Sockets

Our DDR4 sockets provide reliable connections to memory modules for servers, storage, communications equipment and desktop PCs, with up to 20% PCB space savings over DDR3 DIMM sockets.
Features

Please review product documents or contact us for the latest agency approval information.  

Body Features

  • Retention Post Location  Center, Both Ends

  • Ejector Location  Both Ends

  • Module Key Type  Offset Left

  • PCB Retention Feature Material  Brass, Copper Alloy

  • Latch Material  Thermoplastic, High Temperature Thermoplastic, High Temperature Nylon

  • Ejector Material Color  Black, Natural, Green

  • Ejector Material  High Temperature Nylon, Thermoplastic, High Temperature Thermoplastic

  • Connector Profile  Standard

  • Latch Color  Black, Green, Natural

  • Ejector Type  Standard, Rotary

Configuration Features

  • Number of Rows  2

  • Number of Keys  1

  • Number of Bays  2

  • Number of Positions  240

  • Module Orientation  Vertical

Operation/Application

  • Circuit Application  Signal

Dimensions

  • Center Retention Hole Diameter (mm) 1.8, 2.45

  • Center Retention Hole Diameter (in) .07, .096

  • Profile Height from PCB (mm) 21, 23.1

  • Profile Height from PCB (in) .9, .82, .91

  • Row-to-Row Spacing (mm) .95, 1.9, 1.45

  • Row-to-Row Spacing (in) .075, .037, .05

Contact Features

  • Contact Mating Area Plating Material Thickness (µm) .51, .38, .08, .76

  • Contact Mating Area Plating Material Thickness (µin) 15, 3.14, 30, 20

  • Socket Style  DIMM

  • Memory Socket Type  Memory Card

  • PCB Contact Termination Area Plating Material Thickness (µm) 3, 2.54

  • PCB Contact Termination Area Plating Material Thickness (µin) 100, 118.1

  • Contact Base Material  Copper Alloy

  • PCB Contact Termination Area Plating Material  Tin

  • Contact Underplating Material  Nickel

  • Contact Mating Area Plating Material  Gold, Gold Flash

  • Contact Current Rating (Max) (A) .5, .75

Mechanical Attachment

  • Connector Mounting Type  Board Mount

  • Mount Angle  Right Angle, Vertical

  • Mating Alignment Type  Offset Left, Center

  • PCB Mount Retention Type  Solder Tail, Boardlock, Retention Clip/Post, Solder Peg

  • PCB Mount Alignment Type  Locating Posts

  • PCB Mount Retention  With

  • Mating Alignment  Without, With

Housing Features

  • Housing Material  High Temperature Nylon, Thermoplastic

  • Housing Color  Black, Blue, Natural

  • Centerline (Pitch) (mm) 2, 1

  • Centerline (Pitch) (in) .039, .03, .07

Product Type Features

  • Connector & Contact Terminates To  Printed Circuit Board

  • DRAM Type  Double Data Rate (DDR) 3

  • Connector System  Board-to-Board

Industry Standards

  • UL Flammability Rating  UL 94V-0

Termination Features

  • Termination Post & Tail Length (mm) 3.38, 3.18, 4, 2.67, 2.85

  • Termination Post & Tail Length (in) .112, .157, .125, .133, .105

  • Insertion Style  Direct Insert

  • Termination Method to PCB  Surface Mount, Through Hole - Solder, Through Hole - Press-Fit

Packaging Features

  • Packaging Quantity  480, 54, 64, 50

  • Packaging Method  Box & Tray, Hard Tray, Tray

Electrical Characteristics

  • DRAM Voltage (V) 1.5

Usage Conditions

  • Operating Temperature Range (°C) -55 – 105, -40 – 85, -55 – 155

  • Operating Temperature Range (°F) -67 – 311, -40 – 185, -67 – 221

Other

  • EU RoHS Compliance  Compliant

  • EU ELV Compliance  Compliant

Reference Number

  • TE Internal Number CAT-D3303-SO1399

Related Materials
No documentation available.

JEDEC is a trademark of its respective owner.