DDR3 SO DIMM Sockets

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• Connector System  Cable-to-Board

• Connector & Contact Terminates To  Printed Circuit Board

• DRAM Type  Double Data Rate (DDR) 2, Double Data Rate (DDR) 3, Small Outline (SO)

• Number of Keys  1

• Number of Bays  2

• Number of Rows  2

• Module Orientation  Right Angle

• Number of Positions  144

• DRAM Voltage (V) 1.8, 3.3

• SGRAM Voltage (V) 1.8, 3.3

• Latch Plating Material  Tin

• Latch Material  Stainless Steel

• Ejector Type  Locking

• Ejector Location  Both Ends, None

• Module Key Type  DRAM, SDRAM, SGRAM

• Connector Profile  High, Low, Standard

• Memory Socket Type  Memory Card

• Contact Base Material  Copper Alloy, Phosphor Bronze

• PCB Contact Termination Area Plating Material  Gold, Gold Flash, Tin

• Contact Mating Area Plating Material  Gold (Au)

• Contact Mating Area Plating Material Thickness (µm) .25, .76

• Contact Mating Area Plating Material Thickness (µin) 9.84, 30

• Termination Method to PCB  Surface Mount

• Insertion Style  Cam-In

• PCB Mount Retention Type  Hold-Down Post, Solder Tail

• PCB Mount Retention  With

• Mating Alignment Type  Offset Left, Standard Keying

• Connector Mounting Type  Board Mount

• Housing Material  High Temperature Plastic, High Temperature Thermoplastic

• Housing Color  Black, Natural

• Centerline (Pitch)  .8 mm [ .031 in ]

• Stack Height (mm) 5.2, 5.6

• Stack Height (in) .205, .22

• Row-to-Row Spacing (mm) 5.4, 6.2

• Row-to-Row Spacing (in) .21, .244

• Operating Temperature Range  -55 – 105 °C [ -67 – 221 °F ]

• Circuit Application  Signal

• UL Flammability Rating  UL 94V-0

• Packaging Quantity  12, 20, 200, 240, 270

• Packaging Method  Box, Tape & Reel, Tray