DDR3 SO DIMM Sockets

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• Number of Rows  2

• Number of Keys  1

• Number of Bays  2

• Module Orientation  Right Angle

• Number of Positions  144

• Ejector Location  Both Ends, None

• Module Key Type  SDRAM, DRAM, SGRAM

• Latch Material  Stainless Steel

• Ejector Type  Locking

• Latch Plating Material  Tin

• Connector Profile  Low, Standard, High

• SGRAM Voltage (V) 1.8, 3.3

• Connector Mounting Type  Board Mount

• Mating Alignment Type  Standard Keying, Offset Left

• PCB Mount Retention Type  Hold-Down Post, Solder Tail

• PCB Mount Retention  With

• Termination Method to PCB  Surface Mount

• Insertion Style  Cam-In

• Housing Material  High Temperature Plastic, High Temperature Thermoplastic

• Housing Color  Natural, Black

• Centerline (Pitch)  .8 mm [ .031 in ]

• Connector System  Cable-to-Board

• Connector & Contact Terminates To  Printed Circuit Board

• DRAM Type  Double Data Rate (DDR) 3, Small Outline (SO), Double Data Rate (DDR) 2

• Packaging Quantity  240, 200, 20, 12, 270

• Packaging Method  Tape & Reel, Box, Tray, Reel

• UL Flammability Rating  UL 94V-0

• Memory Socket Type  Memory Card

• Contact Base Material  Copper Alloy, Phosphor Bronze

• PCB Contact Termination Area Plating Material  Gold Flash, Gold, Tin

• Contact Mating Area Plating Material  Gold

• Contact Mating Area Plating Material Thickness (µm) .76, .25

• Contact Mating Area Plating Material Thickness (µin) 30, 9.84

• DRAM Voltage (V) 3.3, 1.8

• Stack Height (mm) 4, 5.6, 5.2, 9.9

• Stack Height (in) .389, .205, .157, .22

• Row-to-Row Spacing (mm) 6.2, 5.4

• Row-to-Row Spacing (in) .244, .21

• Operating Temperature Range  -55 – 105 °C [ -67 – 221 °F ]

• Circuit Application  Signal

• EU RoHS Compliance  Compliant

• EU ELV Compliance  Compliant