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Product Listing
DDR4 DIMM SOCKETS
DDR4 DIMM Sockets are designed to JEDEC industry standards. They are available with through hole and surface mount configurations. DDR4 DIMM Socket applications include servers, communications equipment, workstations, and high-performance computing.
Product Features
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DRAM Type : Double Data Rate (DDR) 4
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Connector System : Board-to-Board, Board-to-Bus Bar
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Number of Positions : 288
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Termination Method to PCB : Surface Mount, Through Hole - Solder
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Module Orientation : Vertical
Overview
Product Features
DDR4 Sockets
- Various mounting types: through hole, surface mount, and press fit
- Narrow and standard extractor options
- Various color options for connector housing and extractor
- Accepts memory module per JEDEC MO-309
.85mm
Memory module pitch
288
Number of positions
2.4mm
Seating plane height
TE's DDR4 DIMM sockets are high quality memory sockets designed for use in always-on applications such as data center servers.
PRODUCT ALTERNATIVES
Select Applications
DDR4 Sockets
- Servers
- Storage
- Communications equipment
- Desktop PCs
Features
Please review product documents or contact us for the latest agency approval information.
Body Features
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Retention Post Location None
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Ejector Location Both Ends
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Module Key Type Offset Right
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PCB Retention Feature Material Stainless Steel
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Latch Material High Temperature Thermoplastic
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Ejector Material Color Natural, Blue, Green, Blue (2935U), Black
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Ejector Material High Temperature Thermoplastic
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Connector Profile Standard
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Latch Color Natural, Blue, Black
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Ejector Type Standard
Configuration Features
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Number of Rows 2
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Number of Keys 1
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Number of Bays 2
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Number of Positions 288
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Module Orientation Vertical
Operation/Application
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Circuit Application Signal
Dimensions
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Center Retention Hole Diameter 1.2 mm [ .047 in ]
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Profile Height from PCB 20 mm [ .787 in ]
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Row-to-Row Spacing 2.2 mm [ .08 in ]
Contact Features
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Contact Mating Area Plating Material Thickness (µm) .76, .51, .38
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Contact Mating Area Plating Material Thickness (µin) 15, 30, 20
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Socket Style DIMM
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Memory Socket Type Memory Card
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PCB Contact Termination Area Plating Material Thickness 3 µm [ 118.1 µin ]
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Contact Base Material Copper Alloy
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PCB Contact Termination Area Plating Material Tin
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Contact Underplating Material Nickel
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Contact Mating Area Plating Material Gold
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Contact Current Rating (Max) (A) .75
Mechanical Attachment
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Connector Mounting Type Board Mount
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Mount Angle Vertical
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Mating Alignment Type Offset Right
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PCB Mount Retention Type Boardlock
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PCB Mount Retention With
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Mating Alignment Without, With
Housing Features
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Housing Material High Temperature Nylon, High Temperature Thermoplastic
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Housing Color Blue, Green, Yellow, Natural, Black
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Centerline (Pitch) .85 mm [ .033 in ]
Product Type Features
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Connector & Contact Terminates To Printed Circuit Board
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DRAM Type Double Data Rate (DDR) 4
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Connector System Board-to-Board, Board-to-Bus Bar
Industry Standards
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UL Flammability Rating UL 94V-0
Termination Features
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Termination Post & Tail Length (mm) 2.67, 3.18, 2.1
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Termination Post & Tail Length (in) .083, .125, .105
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Insertion Style Direct Insert
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Termination Method to PCB Surface Mount, Through Hole - Solder
Packaging Features
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Packaging Quantity 80
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Packaging Method Hard Tray, Box & Tray, Tray
Electrical Characteristics
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DRAM Voltage (V) 1.2
Usage Conditions
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Operating Temperature Range -55 – 105 °C [ -67 – 221 °F ]
Other
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EU RoHS Compliance Compliant
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EU ELV Compliance Compliant
Reference Number
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TE Internal Number CAT-D3304-SO1399
Related Materials
No documentation available.
JEDEC is a trademark of its respective owner.
