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Product Listing
DDR4 DIMM SOCKETS
DDR4 DIMM Sockets are designed to JEDEC industry standards. They are available with through hole and surface mount configurations. DDR4 DIMM Socket applications include servers, communications equipment, workstations, and high-performance computing.
Product Features
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DRAM Type : Double Data Rate (DDR) 4
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Connector System : Board-to-Board, Board-to-Bus Bar
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Number of Positions : 288
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Termination Method to PCB : Surface Mount, Through Hole - Solder
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Module Orientation : Vertical
Overview
Product Features
DDR4 Sockets
- Various mounting types: through hole, surface mount, and press fit
- Narrow and standard extractor options
- Various color options for connector housing and extractor
- Accepts memory module per JEDEC MO-309
.85mm
Memory module pitch
288
Number of positions
2.4mm
Seating plane height
TE's DDR4 DIMM sockets are high quality memory sockets designed for use in always-on applications such as data center servers.
PRODUCT ALTERNATIVES
Select Applications
DDR4 Sockets
- Servers
- Storage
- Communications equipment
- Desktop PCs
Features
Please review product documents or contact us for the latest agency approval information.
Product Type Features
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Connector & Contact Terminates To Printed Circuit Board
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DRAM Type Double Data Rate (DDR) 4
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Connector System Board-to-Board, Board-to-Bus Bar
Configuration Features
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Number of Keys 1
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Number of Bays 2
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Number of Rows 2
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Number of Positions 288
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Module Orientation Vertical
Electrical Characteristics
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DRAM Voltage (V) 1.2
Body Features
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Ejector Material High Temperature Thermoplastic
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PCB Retention Feature Material Stainless Steel
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Retention Post Location None
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Connector Profile Standard
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Latch Material High Temperature Thermoplastic
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Latch Color Black, Blue, Natural
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Ejector Location Both Ends
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Module Key Type Offset Right
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Ejector Material Color Black, Blue, Natural
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Ejector Type Standard
Contact Features
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Contact Underplating Material Nickel
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Contact Mating Area Plating Material Gold (Au)
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Socket Style DIMM
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PCB Contact Termination Area Plating Material Thickness 3 µm [ 118.1 µin ]
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Memory Socket Type Memory Card
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Contact Base Material Copper Alloy
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Contact Mating Area Plating Material Thickness (µm) .38, .76
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Contact Mating Area Plating Material Thickness (µin) 15, 30
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PCB Contact Termination Area Plating Material Tin
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Contact Current Rating (Max) (A) .75
Termination Features
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Termination Post & Tail Length 2.1 mm [ .083 in ]
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Insertion Style Direct Insert
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Termination Method to PCB Surface Mount, Through Hole - Solder
Mechanical Attachment
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PCB Mount Retention Type Boardlock
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Mating Alignment With, Without
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PCB Mount Retention With
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Mount Angle Vertical
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Mating Alignment Type Offset Right
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Connector Mounting Type Board Mount
Housing Features
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Housing Material High Temperature Nylon, High Temperature Thermoplastic
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Housing Color Black, Blue, Green, Natural
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Centerline (Pitch) .85 mm [ .033 in ]
Dimensions
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Center Retention Hole Diameter 1.2 mm [ .047 in ]
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Profile Height from PCB 20 mm [ .787 in ]
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Row-to-Row Spacing 2.2 mm [ .08 in ]
Usage Conditions
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Operating Temperature Range -55 – 105 °C [ -67 – 221 °F ]
Operation/Application
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Circuit Application Signal
Industry Standards
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UL Flammability Rating UL 94V-0
Packaging Features
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Packaging Quantity 80
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Packaging Method Box & Tray, Hard Tray, Tray
Reference Number
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TE Internal Number CAT-D3304-SO1399
Related Materials
No documentation available.
JEDEC is a trademark of its respective owner.
