zSFP+ Cage Assembly: EMI Springs

Please review product documents or contact us for the latest agency approval information.  

• Cage Type  Ganged, Single

• Thermal Accessory Type Included  Heat Sink

• Form Factor  zSFP+

• Pluggable I/O Product Type  Cage Assembly

• Sealable  No, Yes

• Lightpipe Style  Standard

• Number of Ports  1, 2, 3, 4, 6, 8

• Port Matrix Configuration  1 x 1, 1 x 2, 1 x 3, 1 x 4, 1 x 6, 1 x 8

• Data Rate (Max) (Gb/s) 16, 28, 32

• Heat Sink Height Class  Custom, Networking Short, Networking Tall, PCI, SAN

• Heat Sink Style  Fin, Pin

• Heat Sink Height (in) .108

• Heat Sink Height  2.75 mm [ .108 in ]

• Heat Sink Finish  Electroless Nickel

• Contact Mating Area Plating Material  Gold (Au)

• Contact Underplating Material  Nickel

• Contact Current Rating (Max) (A) .5

• Tail Plating Material  Gold

• PCB Contact Termination Area Plating Material  Gold, Gold Flash

• Termination Method to PCB  Through Hole - Press-Fit

• Termination Post & Tail Length (mm) 2.05, 3

• Termination Post & Tail Length (in) .071, .081, .118

• Termination Post & Tail Length (mm) 2.05, 3

• Cage Material  Nickel Silver Alloy, Stainless Steel

• PCB Thickness (Recommended) (mm) 1.5, 2.25, 3

• PCB Thickness (Recommended) (in) .059, .089, .118

• PCB Thickness (Recommended) (mm) 1.5, 2.25, 3

• Operating Temperature Range (°C) -40 – 85, -55 – 105

• Operating Temperature Range (°F) -67 – 221, -40 – 185

• Heat Sink Compatible  No, Yes

• Pluggable I/O Applications  EMI Enhanced, SFP+, zSFP+ Thermally Enhanced

• Circuit Application  Signal

• UL Flammability Rating  UL 94V-0

• Packaging Method  Tray

• Included Lightpipe  No, Yes

• EMI Containment Feature Type  Internal/External EMI Springs