zSFP+ Stacked Cage Assembly: EMI Spring

Please review product documents or contact us for the latest agency approval information.  

• Sealable  No, Yes

• Cage Type  Stacked

• Form Factor  zSFP+ Stacked (SFP28)

• Pluggable I/O Product Type  Cage Assembly with Integrated Connector

• Lightpipe Style  Standard

• Port Matrix Configuration  2 x 1, 2 x 8, 2 x 2, 2 x 12, 2 x 6, 2 x 4

• Number of Positions  24, 40, 80, 160, 240, 320, 480

• Number of Ports  2, 4, 8, 12, 16, 24

• Data Rate (Max) (Gb/s) 32

• Tail Plating Material  Tin

• Contact Mating Area Plating Material Thickness  .76 µm [ 29.92 µin ]

• Contact Current Rating (Max) (A) .5

• Contact Mating Area Plating Material  Gold or Gold Flash over Palladium Nickel

• Termination Post & Tail Length  1.8 mm [ .07 in ]

• Cage Material  Nickel Silver Alloy

• Centerline (Pitch) (mm) .8, 4.9

• Centerline (Pitch) (in) .031, .032, .193

• PCB Thickness (Recommended)  1.5 mm [ .059 in ]

• Operating Temperature Range (°C) -55 – 105, -40 – 85, 0 – 70

• Operating Temperature Range (°F) -67 – 221, -40 – 185, 32 – 158

• Heat Sink Compatible  No

• Pluggable I/O Applications  zSFP+ Thermally Enhanced, SFP+ Thermally Enhanced

• Circuit Application  Signal

• UL Flammability Rating  UL 94V-0

• Packaging Method  Tray

• EMI Containment Feature Type  Internal/External EMI Springs

• Included Lightpipe  Yes, No