Co-Packaged Socket Technology

TE has developed socket technologies to allow a separable interface between copper or optical modules and silicon packages for co-packaged architectures. Multiple socket contact technologies allow contact pitches down to 0.40mm while delivering excellent signal integrity performance. •The display showcases functionality of a co-packaged copper link leveraging TE’s co-packaged socket technology. Also displayed is a static mockup showing TE’s uLGA socket in a 51.2T Near Package Optics (NPO) switch implementation.