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DesignCon 2019: 800G OSFP Passive Copper Cable Link
This demo showcases the technologies from TE that will enable 100G based architectures to be successful from signal integrity, thermal and packaging perspectives. Included in this demo are STRADA Whisper cabled backplanes, Sliver internal cable assemblies and OSFP direct attach copper (DAC) cable assemblies - all helping to realize typical 100G chip-to-chip, card-to-card and equipment-to-equipment based high speed connections. These TE products enable interconnecting links to provide necessary BERs for 100G data that will be required for these demanding next-gen architectures. Click video to watch our live 800G OSFP Passive Copper Cable Link demo in action!
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