microQSFP Pluggable I/O Interconnects (English)

Spokesperson: (V.O.) The surge in consumer demand for video content and streaming internet services requires significant increases in data center bandwidth and network infrastructure, but standard I/O connectors are limited in their ability to deliver greater throughput in existing infrastructures because of their size and thermal limitations.

Spokesperson: (V.O.) In response to this growing challenge, TE Connectivity introduces microQFSP Pluggable I/O Interconnects.

microQSFP PLUGGABLE I/O INTERCONNECTS
Higher density connectivity with improved thermal performance

Spokesperson: (V.O.) A revolution in I/O innovation, TE’s Micro Quad Small Form-Factor Pluggable Interconnects provide QSFP28 functionality, in a smaller, generally SFP-sized form-factor.

PRODUCT FEATURES
• Better thermal performance saves energy costs
• Improved electrical performance at 25 Gbps
• 33% higher density than QSFP

Spokesperson: (V.O.) microQSFP’s special design provides significantly better thermal performance to help save energy costs, improves electrical performance at 25 gigabits per second and offers 33 percent higher density than QSFP to fit more ports on a standard line card.

Spokesperson: (V.O ) microQSFP Pluggable I/O Interconnects create a new paradigm in equipment design, enabling total data center functionality and broad market adoption for an array of products such as Networking Switches, Routers, Servers, Networking Interface Cards and Optical Transport Equipment.

microQSFP PLUGGABLE I/O INTERCONNECTS
Higher density connectivity with improved thermal performance
• 56 Gbps PAM-4 performance; backward compatible to 28 Gbps NRZ
• Built-in fins on connector improve thermal performance

Spokesperson: (V.O ) microQSFP connectors and high speed cable assemblies deliver 56 gigabit per second PAM-4 performance with backward compatibility to 28 gigabits per second NRZ to support next generation designs. Built-in fins on TE’s new connectors help reduce the need for additional clips and heatsinks and enable faceplate airflow to the interior of the equipment, which helps microQSFP deliver significantly better thermal performance than QSFP28 and other leading I/O solutions at a lower cost.

Spokesperson: (V.O ) TE is the first company to bring microQSFP products to market from the microQSFP Multi Source Agreement group that is creating an industry-wide ecosystem for microQSFP, and ensuring that products can be easily adopted and integrated into existing data center designs.

microQSFP PLUGGABLE I/O INTERCONNECTS
Higher density connectivity with improved thermal performance
• Higher Density
• Increased Bandwidth
• Improved Thermal Performance

Spokesperson: (V.O.) Leading the way in helping to solve key challenges relating to bandwidth, thermal performance and cost, TE Connectivity’s new microQSFP products are a next generation solution for the future of data center design.

Higher density
Increased bandwidth
Improved thermal performance

microQSFP Pluggable I/O Interconnects from TE Connectivity

Contact your TE representative or distributor today.

Spokesperson: Want to learn more? Contact your TE representative or distributor today!

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