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Product Listing
DDR4 SO DIMM Sockets
DDR4 SO DIMM Sockets are designed to JEDEC industry standards. They are available with standard and reverse key positions, GF, 5u", 10u", 15u", and 30u" gold thicknesses, 4.0mm, 5.2, 8.0, and 9.2 heights, and tray and reel packaging. DDR4 SO DIMM Socket applications include mass storage, communications, desktop PCs, and instrument equipment.
Product Features
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DRAM Type : Small Outline (SO)
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Stack Height (mm): 9.2, 4, 5.2, 8
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Stack Height (in): .205, .157, .315, .362
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Module Orientation : Right Angle
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Number of Positions : 260, 200
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Centerline (Pitch) (mm): 5.4, 7.3, .5, 6.1, 3.3, 2.1
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Centerline (Pitch) (in): .082, .129, .02
Overview
Product Features:
Specifications for DDR4 SO DIMM
- Better performance while consuming less power
- System operating costs can be lowered due to higher performance and less power consumption per socket
- Higher chip density and pin count provides larger DIMM capabilities than DDR3 SO DIMM—transmitting more signal at one time
- One of the largest portfolios with a variety of heights and gold plating options
DDR4 SO DIMM memory sockets provide about 30% better performance than DDR3 SO DIMM memory sockets while consuming about 70% less power.
Features
Please review product documents or contact us for the latest agency approval information.
Configuration Features
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Number of Rows 2
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Number of Keys 1
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Module Orientation Right Angle
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Number of Positions 260, 200
Body Features
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Retention Post Location Both Ends
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Ejector Location Both Ends
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Module Key Type Offset Left, Offset Right
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Latch Material High Temperature Thermoplastic
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Ejector Type Locking
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Retention Post Material Stainless Steel, Copper Alloy
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Connector Profile Low, High
Signal Characteristics
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SGRAM Voltage (V) 1.2
Mechanical Attachment
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Connector Mounting Type Board Mount
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Mating Alignment Type Reverse Keying, Standard Keying
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PCB Mount Retention Type Solder Peg
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PCB Mount Retention With
Termination Features
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Termination Method to PCB Surface Mount
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Insertion Style Cam-In
Housing Features
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Housing Material High Temperature Thermoplastic
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Housing Color Black
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Centerline (Pitch) (mm) 5.4, 7.3, .5, 6.1, 3.3, 2.1
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Centerline (Pitch) (in) .082, .129, .02
Product Type Features
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Connector System Cable-to-Board
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Connector & Contact Terminates To Printed Circuit Board
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DRAM Type Small Outline (SO)
Packaging Features
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Packaging Quantity 800, 900, 500
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Packaging Method Tape & Reel
Industry Standards
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UL Flammability Rating UL 94V-0
Contact Features
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Memory Socket Type Memory Card
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Contact Current Rating (Max) (A) .5
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Contact Base Material Copper Alloy
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PCB Contact Termination Area Plating Material Gold Flash
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Contact Underplating Material Nickel
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Contact Mating Area Plating Material Gold Flash, Gold
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Contact Mating Area Plating Material Thickness (µm) .381, .254, .127, .76
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Contact Mating Area Plating Material Thickness (µin) 5, 30, 10, 15
Electrical Characteristics
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DRAM Voltage (V) 1.2
Dimensions
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Stack Height (mm) 9.2, 4, 5.2, 8
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Stack Height (in) .205, .157, .315, .362
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Row-to-Row Spacing 8.2 mm [ .322 in ]
Usage Conditions
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Operating Temperature Range -55 – 85 °C [ -67 – 185 °F ]
Operation/Application
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Circuit Application Power
Other
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EU RoHS Compliance Compliant
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EU ELV Compliance Compliant
Reference Number
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TE Internal Number CAT-D33047-SO1339
Related Materials
No documentation available.
JEDEC is a trademark of its respective owner.
