Please review product documents or contact us for the latest agency approval information. 

Please Note: Use the Product Drawing for all design activity. 

• Contact Mating Area Plating Material Thickness : 2.032 – 5.08 µm [ 80 – 200 µin ]

• PCB Contact Termination Area Plating Material : Tin-Lead

• Contact Orientation : Straight

• Contact Underplating Material : Nickel

• PCB Contact Termination Area Plating Material Thickness : 2.032 – 5.08 µm [ 80 – 200 µin ]

• Contact Type : Hermaphroditic

• Contact Mating Area Plating Material : Tin-Lead

• Contact Base Material : Brass

• Contact Current Rating (Max) (A): 6

• PCB Mount Retention : Without

• Wire Insulation Support : With

• Contact Retention Type Within Housing : Snap-In

• Compatible Insulation Diameter Range : 2.79 mm [ .11 in ]

• Wire Size (AWG): 24 – 18

• Wire Size (mm²): .2 – .8

• Packaging Quantity : 6000

• Packaging Method : Reel

• Termination Method to Wire & Cable : Crimp

• Product Terminates To : Wire & Cable

• Operating Temperature Range : -55 – 105 °C [ -67 – 221 °F ]

• Circuit Application : Signal