It’s also about how a design fits, relative to alternative technologies. Getting this right is a critical part of a successful solution.
Chad is inspired by intelligence and work ethic. During his early years, he learned from his parents that doing the right things, in applying yourself to your work and taking care of the people who depend on you, is the path to tackling life challenges. Early on, Chad took an interest in Mathematics and Physics, completing Calculus III by the age of 16 at his local university. He was inspired by his high school teacher, a former AMP Incorporated employee, who showed him how an ordinary person can overcome obstacles by sheer will to achieve his vision. Intelligence and hard work are Chad’s approach to solving tough problems. He knows that good solutions also require surrounding himself with highly motivated engineers. These are the people who never accept failure and stay focused on their challenge, regardless of the odds against them. In Chad’s experience, engineers reach an uncommon sense of reward when they are able to realize a unique solution to a difficult problem. Since childhood, Chad has enjoyed taking things apart to see how they work – and putting them back together. It’s this natural curiosity that led him to the possibility of a career in science and engineering. As an inventor listed on around 80 granted patents, with more in process, Chad is eager to drive innovations that customers of TE Connectivity (TE) can utilize every day. Chad takes pride in finding simple but different solutions to complex problems. He is driven to develop high-speed connectivity solutions that can shape the modern world through collaborative teamwork between his TE engineering team and data communications customers.
What are the challenges in making data centers faster?
As with any design, the challenge is the speed-power-cost tradeoff. Designing high-speed electronics is a very competitive space; to succeed, the design must offer advanced performance at the right price. The final cost to the customer involves not only the purchase price , but also the price of power consumption for years to come. The challenge here is understanding the interplay of various design choices. It’s also about how a design fits, relative to alternative technologies. Getting this right is a critical part of a successful solution.
When developing traditional copper interconnect solutions, the challenge is the same as always: To increase the aggregate bandwidth of data that can flow through a given area. Several decades of examination into new materials and design choices have taken us from 10 Mbps buses to 112 Gbps serial data connections. Today, we can run almost 15 Tbps of data through an area of under 2 square inches. We are now working to expand this to 30 Tbps, using an innovative connector design, state-of-the-art PCB materials, and highly optimized differential cable technology. Also, we are working on antenna designs for 5G wireless communications. Beyond wired and wireless communications, one must always be cognizant of the potentially disruptive value proposition of millimeter-wave and optical communications as they continue to mature.
The challenge today is to develop interconnect and transmission line technologies that allow data communications customers to improve the speed, size, and efficiency of their hardware solutions – at a low price. Achieving this requires a thorough understanding of design theory, material characteristics, and manufacturing processes for moving electrons, photons, and electromagnetic waves as efficiently as possible. Resolving design challenges also involves having the right team and partners beside you, while working to put optimal value into the design.
Which technology trends are you watching?
Ever-increasing need for more aggregate bandwidth in hyperscale data centers in the cloud. Everyone is aware of the constant demand for more end-user connections with higher-bandwidth content and instant downloads. This demand, coupled with disaggregation of computing functions, can make a perfect storm for high-speed interconnect demand. Add to this the evolution of 5G wireless connectivity, and it comes together to generate yet another opportunity for high-speed massive MIMO antennas. This is all good for TE, but we must keep our eye on disruptive technologies as well. Such alternate technologies include fiber optics, which is a potential threat if it can reach cost and power consumption parity with electrical signaling.
There are also advanced PCBs and usage of twin-axial cable for delivering speeds of 112 Gbps. Advancement in transmission line materials and constructions calls for the design of compatible interconnects. One must stay ahead in developing these interconnects, which involves monitoring evolution of materials, platings, and manufacturing methods. We must be able to produce very small interconnects, as evidenced by the 400 x 400 micron sockets we are currently examining. As a final note, it is interesting that 3D printing is just now reaching the point of enabling engineers to print functional proof-of-concept plastic parts for highly dense interconnects. We need to monitor the progress of that manufacturing technology.
What would you like to pass on to early-career engineers?
There are three points of emphasis that I would pass on to younger engineers: Passion, Simplicity, and Experience. First, find something in engineering to be passionate about, as it will help you become far more proficient than you would otherwise; for me, RF and digital high-speed electrical engineering will always be my passion. Second, avoid the temptation to over-engineer a solution to solve a problem; if a solution is too complex, there is likely an alternate, more simple way. Third, trust experience over theory; although school, theory, and simulation help tremendously, only living through design mistakes will cement hard lessons that you can apply in the future.
Note that the most gratifying projects are often the ones that challenge an engineer the most. Engineering reach must always extend beyond the current grasp; therefore, don’t be afraid to set stretch goals. Although advanced projects don’t always reach their goals, one should consider such failures a privilege as learning from failure is a rich lesson. Take the hard lessons and apply them to the next project, and success will be the ultimate outcome.
It’s also about how a design fits, relative to alternative technologies. Getting this right is a critical part of a successful solution.
Chad is inspired by intelligence and work ethic. During his early years, he learned from his parents that doing the right things, in applying yourself to your work and taking care of the people who depend on you, is the path to tackling life challenges. Early on, Chad took an interest in Mathematics and Physics, completing Calculus III by the age of 16 at his local university. He was inspired by his high school teacher, a former AMP Incorporated employee, who showed him how an ordinary person can overcome obstacles by sheer will to achieve his vision. Intelligence and hard work are Chad’s approach to solving tough problems. He knows that good solutions also require surrounding himself with highly motivated engineers. These are the people who never accept failure and stay focused on their challenge, regardless of the odds against them. In Chad’s experience, engineers reach an uncommon sense of reward when they are able to realize a unique solution to a difficult problem. Since childhood, Chad has enjoyed taking things apart to see how they work – and putting them back together. It’s this natural curiosity that led him to the possibility of a career in science and engineering. As an inventor listed on around 80 granted patents, with more in process, Chad is eager to drive innovations that customers of TE Connectivity (TE) can utilize every day. Chad takes pride in finding simple but different solutions to complex problems. He is driven to develop high-speed connectivity solutions that can shape the modern world through collaborative teamwork between his TE engineering team and data communications customers.
What are the challenges in making data centers faster?
As with any design, the challenge is the speed-power-cost tradeoff. Designing high-speed electronics is a very competitive space; to succeed, the design must offer advanced performance at the right price. The final cost to the customer involves not only the purchase price , but also the price of power consumption for years to come. The challenge here is understanding the interplay of various design choices. It’s also about how a design fits, relative to alternative technologies. Getting this right is a critical part of a successful solution.
When developing traditional copper interconnect solutions, the challenge is the same as always: To increase the aggregate bandwidth of data that can flow through a given area. Several decades of examination into new materials and design choices have taken us from 10 Mbps buses to 112 Gbps serial data connections. Today, we can run almost 15 Tbps of data through an area of under 2 square inches. We are now working to expand this to 30 Tbps, using an innovative connector design, state-of-the-art PCB materials, and highly optimized differential cable technology. Also, we are working on antenna designs for 5G wireless communications. Beyond wired and wireless communications, one must always be cognizant of the potentially disruptive value proposition of millimeter-wave and optical communications as they continue to mature.
The challenge today is to develop interconnect and transmission line technologies that allow data communications customers to improve the speed, size, and efficiency of their hardware solutions – at a low price. Achieving this requires a thorough understanding of design theory, material characteristics, and manufacturing processes for moving electrons, photons, and electromagnetic waves as efficiently as possible. Resolving design challenges also involves having the right team and partners beside you, while working to put optimal value into the design.
Which technology trends are you watching?
Ever-increasing need for more aggregate bandwidth in hyperscale data centers in the cloud. Everyone is aware of the constant demand for more end-user connections with higher-bandwidth content and instant downloads. This demand, coupled with disaggregation of computing functions, can make a perfect storm for high-speed interconnect demand. Add to this the evolution of 5G wireless connectivity, and it comes together to generate yet another opportunity for high-speed massive MIMO antennas. This is all good for TE, but we must keep our eye on disruptive technologies as well. Such alternate technologies include fiber optics, which is a potential threat if it can reach cost and power consumption parity with electrical signaling.
There are also advanced PCBs and usage of twin-axial cable for delivering speeds of 112 Gbps. Advancement in transmission line materials and constructions calls for the design of compatible interconnects. One must stay ahead in developing these interconnects, which involves monitoring evolution of materials, platings, and manufacturing methods. We must be able to produce very small interconnects, as evidenced by the 400 x 400 micron sockets we are currently examining. As a final note, it is interesting that 3D printing is just now reaching the point of enabling engineers to print functional proof-of-concept plastic parts for highly dense interconnects. We need to monitor the progress of that manufacturing technology.
What would you like to pass on to early-career engineers?
There are three points of emphasis that I would pass on to younger engineers: Passion, Simplicity, and Experience. First, find something in engineering to be passionate about, as it will help you become far more proficient than you would otherwise; for me, RF and digital high-speed electrical engineering will always be my passion. Second, avoid the temptation to over-engineer a solution to solve a problem; if a solution is too complex, there is likely an alternate, more simple way. Third, trust experience over theory; although school, theory, and simulation help tremendously, only living through design mistakes will cement hard lessons that you can apply in the future.
Note that the most gratifying projects are often the ones that challenge an engineer the most. Engineering reach must always extend beyond the current grasp; therefore, don’t be afraid to set stretch goals. Although advanced projects don’t always reach their goals, one should consider such failures a privilege as learning from failure is a rich lesson. Take the hard lessons and apply them to the next project, and success will be the ultimate outcome.
