Industry Tradeshow
DESIGNCON 2025
Join us at DesignCon 2025!
January 28-30, 2025
Santa Clara Convention Center
Santa Clara, California, USA
BOOTH 639
Empowering the AI Evolution at DesignCon 2025
TE Connectivity (TE) is empowering the artificial intelligence (AI) and machine learning (ML) evolution through a robust portfolio of interconnected solutions engineered for high speed and power efficiency in data center architectures.
The advent of the AI/ML era is driving a major revolution in scale, complexity, and time-to-market of compute architectures at both the data center and at the edge. Interconnect solutions are more critical than ever in providing low-latency GPU-to-GPU clustering and connectivity; memory pooling and disaggregation; and efficient thermal management.
TE's product displays and partnerships at DesignCon 2025 will demonstrate how our our latest innovations around cabled backplane, high-speed cables, and liquid and thermal cooling, are enabling our customers to build the next generation of AI systems.
TE Expert Talks
at DesignCon 2025
- Practical Implementation of Insertion Loss Correction & Delay Characterization of Test Fixtures Used for 200 Gbps Per Lane Conformance Testing
- Jason Ellison
- Wednesday, January 29th | 8:00am PST | Ballroom E
- PANEL: OIF Update on 224 Gbps & 448 Gbps Common Electrical I/O CEI Development
- Nathan Tracy
- Wednesday, January 29th | 4:00 PST | Ballroom C
- Path to PCIe Gen 7.0: Challenges & Design Considerations for Next Generation Internal Cabling
- Ashika Pandankeril Shaji
- Thursday, January 30th | 11:15am PST | Ballroom E
- PANEL: Energy Efficient Interfaces for the Next Generation of AI Compute
- Nathan Tracy
- Thursday, January 30th | 1:15pm PST | Chiphead Theater
Product Solutions on Display at DesignCon 2025
Rack-Level Solutions: Showcasing TE's innovative connectivity solutions for compute, power, switch, and storage.
Liquid Cooled Power Busbar Assembly: TE is enabling higher power distribution for next-gen AI racks with an innovative liquid cooled busbar solution, presented in partnership with Cooler Master. The use of liquid cooled infrastructures to cool the power busbars allows for higher current capacities while maintaining lower temperatures.
Advanced High-Speed I/O Liquid Cooling & Thermal Bridge Hybrid Solution: In this demonstration, TE is showcasing our next-generation thermal solution for future high-speed I/O products. By combining TE's patented thermal bridge components with a liquid cooling cold plate structure, TE presents the market with this efficient technology for solving some of the most challenging thermal problems.
Ultra High-Density Connector for Co-Packaged Copper Applications
AdrenaLINE Slingshot and AdrenaLINE Catapult: TE's AdrenaLINE connectors can seamlessly combine cutting-edge technology with top-tier performance, enabling the evolution of AI and ML systems. This demo showcasing TE's cabled backplane architecture is supported by MultiLane.
Industry Tradeshow
DESIGNCON 2025
Join us at DesignCon 2025!
January 28-30, 2025
Santa Clara Convention Center
Santa Clara, California, USA
BOOTH 639
Empowering the AI Evolution at DesignCon 2025
TE Connectivity (TE) is empowering the artificial intelligence (AI) and machine learning (ML) evolution through a robust portfolio of interconnected solutions engineered for high speed and power efficiency in data center architectures.
The advent of the AI/ML era is driving a major revolution in scale, complexity, and time-to-market of compute architectures at both the data center and at the edge. Interconnect solutions are more critical than ever in providing low-latency GPU-to-GPU clustering and connectivity; memory pooling and disaggregation; and efficient thermal management.
TE's product displays and partnerships at DesignCon 2025 will demonstrate how our our latest innovations around cabled backplane, high-speed cables, and liquid and thermal cooling, are enabling our customers to build the next generation of AI systems.
TE Expert Talks
at DesignCon 2025
- Practical Implementation of Insertion Loss Correction & Delay Characterization of Test Fixtures Used for 200 Gbps Per Lane Conformance Testing
- Jason Ellison
- Wednesday, January 29th | 8:00am PST | Ballroom E
- PANEL: OIF Update on 224 Gbps & 448 Gbps Common Electrical I/O CEI Development
- Nathan Tracy
- Wednesday, January 29th | 4:00 PST | Ballroom C
- Path to PCIe Gen 7.0: Challenges & Design Considerations for Next Generation Internal Cabling
- Ashika Pandankeril Shaji
- Thursday, January 30th | 11:15am PST | Ballroom E
- PANEL: Energy Efficient Interfaces for the Next Generation of AI Compute
- Nathan Tracy
- Thursday, January 30th | 1:15pm PST | Chiphead Theater
Product Solutions on Display at DesignCon 2025
Rack-Level Solutions: Showcasing TE's innovative connectivity solutions for compute, power, switch, and storage.
Liquid Cooled Power Busbar Assembly: TE is enabling higher power distribution for next-gen AI racks with an innovative liquid cooled busbar solution, presented in partnership with Cooler Master. The use of liquid cooled infrastructures to cool the power busbars allows for higher current capacities while maintaining lower temperatures.
Advanced High-Speed I/O Liquid Cooling & Thermal Bridge Hybrid Solution: In this demonstration, TE is showcasing our next-generation thermal solution for future high-speed I/O products. By combining TE's patented thermal bridge components with a liquid cooling cold plate structure, TE presents the market with this efficient technology for solving some of the most challenging thermal problems.
Ultra High-Density Connector for Co-Packaged Copper Applications
AdrenaLINE Slingshot and AdrenaLINE Catapult: TE's AdrenaLINE connectors can seamlessly combine cutting-edge technology with top-tier performance, enabling the evolution of AI and ML systems. This demo showcasing TE's cabled backplane architecture is supported by MultiLane.
