
With TE Connectivity's (TE) plug-and-play power connectors, busbars and cable assembly solutions for Open Compute Project (OCP) architecture , you get a standardized platform for system designs. These solutions are compatible with specifications designed for use in rack-level power distribution from facility power to motherboard applications, including the power shelf, all IT gear, server and compute shelfs. TE offers numerous power solutions to address many of your special design requirements.
Our power solutions portfolio for Open Compute Project (OCP) applications provides multiple simple, yet customizable, designs that enable a standardized platform capable of efficiently distributing up to 500A of power per UL and CSA criteria, while offering improved electrical performance. These plug-and-play solutions support 48V architectures, while offering low resistance and low milli-volt drop. We help our customers realize operations and overall systems savings by providing power products that support low energy consumption and address thermal concerns. These products are compatible with specifications for use in rack-level applications, including power shelves, battery backup unit (BBU) shelves, IT Gear, and server sleds.
TE Power Solutions Support
- Wide range of connectors, cable assemblies and busbar that supply power distribution throughout the rack
- Highly versatile portfolio of power distribution products that meet Open Rack v3 (Orv3) standards
- End-to-end link from facility power source to motherboard using proven interconnect solutions
OCP Power Distribution Solutions
Select Applications
- OCP Data Centers
- V2 Open Rack Storage (Cubby)
- Power distribution
- Battery back-up
- Power shelves
Innovations in Power & Cooling
Innovations in Power & Cooling
In collaboration with several industry-leading ecosystem partners, TE is bringing new innovative solutions to market, enabling the next-generation power busbar solutions empowering the future of artificial intelligence (AI) technology.
Immersion Cooling Solutions
The recently deployed immersion cooling proof of concept, developed in collaboration with Submer and other OCP partners, seamlessly integrates immersion cooling technology with the OCP Open Rack v3 (ORv3) infrastructure. This integration, featuring busbars from TE, significantly enhances energy efficiency and thermal management capabilities, offering an innovation solution for modern data center challenges.

Liquid Cooling Solutions
In partnership with advanced cooling manufacturers, like Cooler Master, TE’s innovative liquid cooled power busbar assembly is helping to deliver higher power distribution and more efficient cooling for high-density data center racks. As rack level power requirements continue to increase, power busbar capacities need to follow suit. Incorporating this solution into existing rack infrastructure allows customers to meet the growing power demands of AI workloads, without increasing busbar footprint.
Our Liquid cooled vertical busbar is enabling higher power distribution for next-generation AI racks.
Product Promos

With TE Connectivity's (TE) plug-and-play power connectors, busbars and cable assembly solutions for Open Compute Project (OCP) architecture , you get a standardized platform for system designs. These solutions are compatible with specifications designed for use in rack-level power distribution from facility power to motherboard applications, including the power shelf, all IT gear, server and compute shelfs. TE offers numerous power solutions to address many of your special design requirements.
Our power solutions portfolio for Open Compute Project (OCP) applications provides multiple simple, yet customizable, designs that enable a standardized platform capable of efficiently distributing up to 500A of power per UL and CSA criteria, while offering improved electrical performance. These plug-and-play solutions support 48V architectures, while offering low resistance and low milli-volt drop. We help our customers realize operations and overall systems savings by providing power products that support low energy consumption and address thermal concerns. These products are compatible with specifications for use in rack-level applications, including power shelves, battery backup unit (BBU) shelves, IT Gear, and server sleds.
TE Power Solutions Support
- Wide range of connectors, cable assemblies and busbar that supply power distribution throughout the rack
- Highly versatile portfolio of power distribution products that meet Open Rack v3 (Orv3) standards
- End-to-end link from facility power source to motherboard using proven interconnect solutions
OCP Power Distribution Solutions
Select Applications
- OCP Data Centers
- V2 Open Rack Storage (Cubby)
- Power distribution
- Battery back-up
- Power shelves
Innovations in Power & Cooling
Innovations in Power & Cooling
In collaboration with several industry-leading ecosystem partners, TE is bringing new innovative solutions to market, enabling the next-generation power busbar solutions empowering the future of artificial intelligence (AI) technology.
Immersion Cooling Solutions
The recently deployed immersion cooling proof of concept, developed in collaboration with Submer and other OCP partners, seamlessly integrates immersion cooling technology with the OCP Open Rack v3 (ORv3) infrastructure. This integration, featuring busbars from TE, significantly enhances energy efficiency and thermal management capabilities, offering an innovation solution for modern data center challenges.

Liquid Cooling Solutions
In partnership with advanced cooling manufacturers, like Cooler Master, TE’s innovative liquid cooled power busbar assembly is helping to deliver higher power distribution and more efficient cooling for high-density data center racks. As rack level power requirements continue to increase, power busbar capacities need to follow suit. Incorporating this solution into existing rack infrastructure allows customers to meet the growing power demands of AI workloads, without increasing busbar footprint.
Our Liquid cooled vertical busbar is enabling higher power distribution for next-generation AI racks.