Industry Tradeshow
OCP Global Summit 2023
Empowering the AI Evolution
October 17-19, 2023
Thank you for joining us!
Empowering the AI Evolution
TE Connectivity (TE) is empowering the artificial intelligence (AI) and machine learning (ML) evolution through a robust portfolio of interconnected solutions engineered for high speed and power efficiency in data center architectures.
Developing efficient, next generation AI/ML infrastructures requires interconnected clustering and networking systems with high-performance/low-latency compute and memory capabilities and optimized power and cooling distribution. TE’s product displays and partnerships at the OCP Global Summit will demonstrate how TE is driving the future of artificial intelligence and machine learning, providing cutting-edge solutions to meet today’s processing needs and anticipate tomorrow’s forward-thinking designs.
TE Expert Talks at OCP Global Summit 2023
- Disaggregated & Composable Architectures: The Importance of Extended PCIe Cabling
- Chris Blackburn, Principal Technologist - System Architecture & Brian Costello, System Architect
- Chris Blackburn, Principal Technologist - System Architecture & Brian Costello, System Architect
- Card Edge Interconnects - Understanding Device and Riser Card Connectivity Tradeoffs
- Chris Blackburn, Principal Technologist - System Architecture
- Chris Blackburn, Principal Technologist - System Architecture
Power & Cooling
Product solutions on display at OCP 2023
- Power Distribution for Data Center Rack: TE's power solutions for data center rack showcases the latest power distribution products addressing 12V system and 48V next generation system architectures' demand for higher power distribution solutions to support cost effectiveness, safety, high/low volume production, and reliability:
- Input and output interconnect solutions
- Integrated busbar assemblies with liquid cooling options
- Custom power cable assembiles
- Quick connect-and-disconnect high power RAPID LOCK cable assemblies
- CROWN CLIP Jr. busbar clip
- ELCON Mini connector solutions
- High current card edge products
- MULTI-BEAM Plus power connectors
- Input and output interconnect solutions
- Smart Busbar Connector for Server Racks: Power connectors inside server racks may undergo temperature-related failures, causing service disruption. Outfitting power connectors with sensors enables real-time monitoring of their condition, alowing careful overdriving and planned repairs. Through thermal characterization of busbar power connectors and measurements of the RF communication channels, a prototype smart busbar connector was developed. The demonstration kit highlights this effort in a live, visual format for expo-goers to enjoy. A touchscreen interface provides controls for heating a sample busbar and graphs temperature data, measured from the smart busbar connectors.
- Liquid Cooled Power Busbar Assembly: In partnership with Cooler Master, TE is enabling the next-gen power busbar solutions helping to empower the AI evoluiton. As rack level power requirements continue to increase, power busbar capacities need to follow suit. The use of liquid cooled infrastructures to cool the power busbars allows for higher current capacities while maintaining lower temperatures.
- Submer's SmartPod OCP ORv3: In Submer's booth (C9), see how TE's busbars are helping to build a more efficient and flexible rack-level infrastructure for data centers through the use of immersion cooling technology.
Clustering & Networking
Product solutions on display at OCP 2023
- 112G STRADA Whisper Cabled Backplane Cartridge: TE's STRADA Whisper Absolute cabled backplane product line is in production supporting our customer's architecture in giant-scale AI and high-performance computing (HPC) applications. This cartridge supports the industry's first CPU + GPU superchip design and is the leading reference design for AI and ML applications. TE’s cabled backplane assembled into a cartridge assembly provides a lower cost of ownership for our customers. Its zero-mate mechanical system, designed by TE and combined with best-in-class signal integrity (SI) performance, ensures mechanical robustness and makes STRADA Whisper cabled backplanes the go-to product for low-latency high-speed interconnect architectures.
- AdrenaLINE Catapult 224G Near Chip Connector and AdrenaLINE Slingshot Cabled Backplane Connector for AI/ML Training: AL and ML architectures are increasingly using cabled backplane for high-speed and high-bandwidth connections between the accelerator chips. This enables the sleds to be blind-mated for easy installation and serviceability. This architecture is typically rack-scale, but this scaled down version highlights the AdrenaLINE 224G family of products including AdrenaLINE Catapult near chip connector cabled to the AdrenaLINE Slingshot panel mount backplane connector, an AdrenaLINE Slingshot cabled backplane cartridge, and an AdrenaLINE Slingshot right-angle PCB connector.
Compute & Memory
Product solutions on display at OCP 2023
- External PCIe Cabling: Next Generation Architectures for CXL Switching and Disaggregated Memory: Next generation system architectures demand improvements in efficiency to help drive cost and performance optimizations. Disaggregated and composable architectures enable the use of pooled resources like compute, memory, hardware acceleration and storage, and allow these resources to be utilized dynamically when they are needed. These disaggregated architectures leverage external PCIe cabling in the industry standard form factor CDFP. These system mockups demonstrate applications like CXL switching, disaggregated memory modules, and PCIe retimer cards enabled by CDFP connectors and cables.
- Next Gen PCIe Architectures with Cabled OCP NIC 3.0 Solutions: With the growing need for channel margin and overall channel flexibility, TE’s cabled receptacle solutions help reduce the number of system SKUs for the end user and simplify their design choices with TE’s portfolio of mechanically robust interfaces. We can leverage this design methodology and application with OCP NIC 3.0 and DC-SCM. TE’s solutions can adapt to interface with other industry-wide form factors such as PCIe-CEM, EDSFF, and can leverage our continuously growing product portfolio, including Sliver, MCIO, MXIO and LPSS connectors and cable assemblies.
- PCIe Gen 6 CDFP Passive Copper Cable Solutions: AI/ML are accelerating the demand for high-performance, high-density, and low-latency interconnect solutions. Disaggregated architectures increase the demand for external copper cabling that can run next-gen PCIe Gen 6 and CXL protocols. CDFP is the interconnect adopted by PCI-SIG and defined by SNIA in SFF-TA-1032. TE’s cutting edge twinax cable and termination technology paired with Marvell’s 5nm PCIe Gen 6 SerDes demonstrates passive copper cabling solutions beyond 3m at 64GT/s (PCIe Gen 6). Passive copper cabling solutions offer the lowest latency and lowest cost solutions available.
TE Connectivity’s MULTI-BEAM Plus power connectors address the current market need for higher power and higher performance, pushing current up to 100A/contact, with four adjacent pins per connector.
Industry Tradeshow
OCP Global Summit 2023
Empowering the AI Evolution
October 17-19, 2023
Thank you for joining us!
Empowering the AI Evolution
TE Connectivity (TE) is empowering the artificial intelligence (AI) and machine learning (ML) evolution through a robust portfolio of interconnected solutions engineered for high speed and power efficiency in data center architectures.
Developing efficient, next generation AI/ML infrastructures requires interconnected clustering and networking systems with high-performance/low-latency compute and memory capabilities and optimized power and cooling distribution. TE’s product displays and partnerships at the OCP Global Summit will demonstrate how TE is driving the future of artificial intelligence and machine learning, providing cutting-edge solutions to meet today’s processing needs and anticipate tomorrow’s forward-thinking designs.
TE Expert Talks at OCP Global Summit 2023
- Disaggregated & Composable Architectures: The Importance of Extended PCIe Cabling
- Chris Blackburn, Principal Technologist - System Architecture & Brian Costello, System Architect
- Chris Blackburn, Principal Technologist - System Architecture & Brian Costello, System Architect
- Card Edge Interconnects - Understanding Device and Riser Card Connectivity Tradeoffs
- Chris Blackburn, Principal Technologist - System Architecture
- Chris Blackburn, Principal Technologist - System Architecture
Power & Cooling
Product solutions on display at OCP 2023
- Power Distribution for Data Center Rack: TE's power solutions for data center rack showcases the latest power distribution products addressing 12V system and 48V next generation system architectures' demand for higher power distribution solutions to support cost effectiveness, safety, high/low volume production, and reliability:
- Input and output interconnect solutions
- Integrated busbar assemblies with liquid cooling options
- Custom power cable assembiles
- Quick connect-and-disconnect high power RAPID LOCK cable assemblies
- CROWN CLIP Jr. busbar clip
- ELCON Mini connector solutions
- High current card edge products
- MULTI-BEAM Plus power connectors
- Input and output interconnect solutions
- Smart Busbar Connector for Server Racks: Power connectors inside server racks may undergo temperature-related failures, causing service disruption. Outfitting power connectors with sensors enables real-time monitoring of their condition, alowing careful overdriving and planned repairs. Through thermal characterization of busbar power connectors and measurements of the RF communication channels, a prototype smart busbar connector was developed. The demonstration kit highlights this effort in a live, visual format for expo-goers to enjoy. A touchscreen interface provides controls for heating a sample busbar and graphs temperature data, measured from the smart busbar connectors.
- Liquid Cooled Power Busbar Assembly: In partnership with Cooler Master, TE is enabling the next-gen power busbar solutions helping to empower the AI evoluiton. As rack level power requirements continue to increase, power busbar capacities need to follow suit. The use of liquid cooled infrastructures to cool the power busbars allows for higher current capacities while maintaining lower temperatures.
- Submer's SmartPod OCP ORv3: In Submer's booth (C9), see how TE's busbars are helping to build a more efficient and flexible rack-level infrastructure for data centers through the use of immersion cooling technology.
Clustering & Networking
Product solutions on display at OCP 2023
- 112G STRADA Whisper Cabled Backplane Cartridge: TE's STRADA Whisper Absolute cabled backplane product line is in production supporting our customer's architecture in giant-scale AI and high-performance computing (HPC) applications. This cartridge supports the industry's first CPU + GPU superchip design and is the leading reference design for AI and ML applications. TE’s cabled backplane assembled into a cartridge assembly provides a lower cost of ownership for our customers. Its zero-mate mechanical system, designed by TE and combined with best-in-class signal integrity (SI) performance, ensures mechanical robustness and makes STRADA Whisper cabled backplanes the go-to product for low-latency high-speed interconnect architectures.
- AdrenaLINE Catapult 224G Near Chip Connector and AdrenaLINE Slingshot Cabled Backplane Connector for AI/ML Training: AL and ML architectures are increasingly using cabled backplane for high-speed and high-bandwidth connections between the accelerator chips. This enables the sleds to be blind-mated for easy installation and serviceability. This architecture is typically rack-scale, but this scaled down version highlights the AdrenaLINE 224G family of products including AdrenaLINE Catapult near chip connector cabled to the AdrenaLINE Slingshot panel mount backplane connector, an AdrenaLINE Slingshot cabled backplane cartridge, and an AdrenaLINE Slingshot right-angle PCB connector.
Compute & Memory
Product solutions on display at OCP 2023
- External PCIe Cabling: Next Generation Architectures for CXL Switching and Disaggregated Memory: Next generation system architectures demand improvements in efficiency to help drive cost and performance optimizations. Disaggregated and composable architectures enable the use of pooled resources like compute, memory, hardware acceleration and storage, and allow these resources to be utilized dynamically when they are needed. These disaggregated architectures leverage external PCIe cabling in the industry standard form factor CDFP. These system mockups demonstrate applications like CXL switching, disaggregated memory modules, and PCIe retimer cards enabled by CDFP connectors and cables.
- Next Gen PCIe Architectures with Cabled OCP NIC 3.0 Solutions: With the growing need for channel margin and overall channel flexibility, TE’s cabled receptacle solutions help reduce the number of system SKUs for the end user and simplify their design choices with TE’s portfolio of mechanically robust interfaces. We can leverage this design methodology and application with OCP NIC 3.0 and DC-SCM. TE’s solutions can adapt to interface with other industry-wide form factors such as PCIe-CEM, EDSFF, and can leverage our continuously growing product portfolio, including Sliver, MCIO, MXIO and LPSS connectors and cable assemblies.
- PCIe Gen 6 CDFP Passive Copper Cable Solutions: AI/ML are accelerating the demand for high-performance, high-density, and low-latency interconnect solutions. Disaggregated architectures increase the demand for external copper cabling that can run next-gen PCIe Gen 6 and CXL protocols. CDFP is the interconnect adopted by PCI-SIG and defined by SNIA in SFF-TA-1032. TE’s cutting edge twinax cable and termination technology paired with Marvell’s 5nm PCIe Gen 6 SerDes demonstrates passive copper cabling solutions beyond 3m at 64GT/s (PCIe Gen 6). Passive copper cabling solutions offer the lowest latency and lowest cost solutions available.
TE Connectivity’s MULTI-BEAM Plus power connectors address the current market need for higher power and higher performance, pushing current up to 100A/contact, with four adjacent pins per connector.
