
Automotive Header Portfolio
TE Connectivity’s new automotive header portfolio connects PCB's for growing digital interfaces. Automotive header solutions for signal and low-power transmission support the demand for miniaturized components and growing number of inputs/outputs.
October 18, 2016
TE Connectivity (TE), a world leader in connectivity and sensor solutions, today announced a comprehensive portfolio of headers designed to connect printed circuit boards (PCBs) in electronic control units (ECUs) for automotive applications. The growing functional content and increasing number of digital interfaces require higher integration levels. The new portfolio also addresses the automotive industry’s push for miniaturization, as well as press-fit connections and surface-mount technology (SMT).
TE headers establish electrical connections between PCBs and other components within the harsh automotive environment. The portfolio includes standard automotive headers with low pin counts and customized headers with high pin counts. The standard headers are designed for automotive applications that require signal and low-power transmission. The portfolio includes sealed and unsealed products in 90-degree and 180-degree orientations.
As vehicle ECU pin counts go up, TE headers provide a solution for extremely compact interconnection technologies like applied in the NanoMQS connectors. The headers build on existing and widely used terminal technologies so there is a mating counterpart for almost every header.
“Our comprehensive header portfolio provides solutions for the interface between sensitive electronics and critical components across the harsh automotive environment,” said Alexander Ginsburg, CAM product manager for EMEA, Automotive, TE. “The well-proven products also address key global trends such as miniaturization, increasingly high pin counts and economic processing technologies such as surface mounting and press-fit.”
TE products connect nearly every electrical function in cars – from alternative power systems to infotainment and sensor technologies.