Excellent I/O electrical performance and high density for use in Intel Omni-Path Architecture (OPA)
Support Intel OPA switch reference designs with 3-high capability
September 27, 2017
Harrisburg, PA – September 27, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced its new zQSFP+ belly-to-belly cages and connector for Intel®Omni-Path Architecture (OPA) switch reference designs. These single high and belly-to-belly cages are designed to address the increasing need for higher density I/O ports, supporting high throughput silicon chips.
With the addition of these cages to their portfolio, TE is now able to supply a full solution for Intel’s® OPA fabric design. Use these cages in tandem with TE’s LGA 3647 sockets and ChipConnect internal faceplate-to-processor cable assemblies for Intel OPA reference designs.
In addition, TE’s zQSFP+ single high cage is now qualified for use on the Intel OPA NIC card reference designs.
For more information on zQSFP+ products, please click here.
