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1473149-1

Active

Double Data Rate (DDR), Stack Height 5.2 mm [.205 in], Right Angle Module Orientation, 200 Position, .6 mm [.024 in] Centerline, SO DIMM Sockets

1473149-1

Active

Double Data Rate (DDR), Stack Height 5.2 mm [.205 in], Right Angle Module Orientation, 200 Position, .6 mm [.024 in] Centerline, SO DIMM Sockets

TE Internal #: 1473149-1
TE Internal Description: SEMI-HARD TRAY ASSY DDR 200P 5
All DDR2 SO DIMM Sockets (30)

Packaging Method : Semi-Hard Tray Assembly, Tray
Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]
Ejector Type : Locking
Stack Height : 5.2 mm [ .205 in ]

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Compatible Parts & Tooling

Documents

Product Drawings

DDR1 & DDR2 SODIMM SOCKET 0.6mm PITCH 200POS STANDARD PROFILE STANDARD TYPE (NEW LATCH TYPE) ENG_CD_1473149_K3.pdf English

CAD Files

Download ECAD Model File
Download the free Library Loader to convert this file to your ECAD Tool. Learn more about the ECAD Model.
3D PDF 3D_CVM_CVM_1473149-1_K2.pdf 3D
Customer View Model ENG_CVM_CVM_1473149-1_K2.2d_dxf.zip English
ENG_CVM_CVM_1473149-1_K2.3d_igs.zip English
ENG_CVM_CVM_1473149-1_K2.3d_stp.zip English

Product Specifications

Product Specification ENG_SS_108-5701_F.pdf English

Product Change Notification

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Features

Please review product documents or contact us for the latest agency approval information.

Please Note: Use the Product Drawing for all design activity.

Product Type Features

Connector & Contact Terminates To : Printed Circuit Board
Connector System : Cable-to-Board
DRAM Type : Double Data Rate (DDR)

Configuration Features

Number of Keys : 1
Number of Positions : 200
Number of Rows : 2
Number of Bays : 2
Module Orientation : Right Angle

Electrical Characteristics

DRAM Voltage (V): 2.5

Signal Characteristics

SGRAM Voltage (V): 2.5

Body Features

Ejector Type : Locking
Module Key Type : SGRAM
Connector Profile : Standard
Ejector Location : Both Ends
Latch Material : Stainless Steel
Latch Plating Material : Tin

Contact Features

Memory Socket Type : Memory Card
Contact Base Material : Copper Alloy
PCB Contact Termination Area Plating Material : Gold Flash
Contact Mating Area Plating Material : Gold Flash
Contact Current Rating (Max) (A): .5

Termination Features

Insertion Style : Cam-In

Mechanical Attachment

PCB Mount Retention Type : Solder Peg
Connector Mounting Type : Board Mount
Mating Alignment Type : Reverse Keying
PCB Mount Retention : With

Housing Features

Housing Material : High Temperature Thermoplastic
Centerline (Pitch) : .6 mm [ .024 in ]
Housing Color : Black

Dimensions

Stack Height : 5.2 mm [ .205 in ]
Row-to-Row Spacing : 6.2 mm [ .244 in ]

Usage Conditions

Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Operation/Application

Circuit Application : Power

Industry Standards

UL Flammability Rating : UL 94V-0

Packaging Features

Packaging Method : Semi-Hard Tray Assembly, Tray
Packaging Quantity : 20

1473149-1

Double Data Rate (DDR), Stack Height 5.2 mm [.205 in], Right Angle Module Orientation, 200 Position, .6 mm [.024 in] Centerline, SO DIMM Sockets

1473149-1

Double Data Rate (DDR), Stack Height 5.2 mm [.205 in], Right Angle Module Orientation, 200 Position, .6 mm [.024 in] Centerline, SO DIMM Sockets

Packaging Method : Semi-Hard Tray Assembly, Tray

Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Ejector Type : Locking

Stack Height : 5.2 mm [ .205 in ]

Documents

Product Drawings

CAD Files

Product Specifications

Product Change Notification

Features

Product Type Features

Connector & Contact Terminates To : Printed Circuit Board

Connector System : Cable-to-Board

DRAM Type : Double Data Rate (DDR)

Configuration Features

Number of Keys : 1

Number of Positions : 200

Number of Rows : 2

Number of Bays : 2

Module Orientation : Right Angle

Electrical Characteristics

DRAM Voltage (V): 2.5

Signal Characteristics

SGRAM Voltage (V): 2.5

Body Features

Ejector Type : Locking

Module Key Type : SGRAM

Connector Profile : Standard

Ejector Location : Both Ends

Latch Material : Stainless Steel

Latch Plating Material : Tin

Contact Features

Memory Socket Type : Memory Card

Contact Base Material : Copper Alloy

PCB Contact Termination Area Plating Material : Gold Flash

Contact Mating Area Plating Material : Gold Flash

Contact Current Rating (Max) (A): .5

Termination Features

Insertion Style : Cam-In

Mechanical Attachment

PCB Mount Retention Type : Solder Peg

Connector Mounting Type : Board Mount

Mating Alignment Type : Reverse Keying

PCB Mount Retention : With

Housing Features

Housing Material : High Temperature Thermoplastic

Centerline (Pitch) : .6 mm [ .024 in ]

Housing Color : Black

Dimensions

Stack Height : 5.2 mm [ .205 in ]

Row-to-Row Spacing : 6.2 mm [ .244 in ]

Usage Conditions

Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Operation/Application

Circuit Application : Power

Industry Standards

UL Flammability Rating : UL 94V-0

Packaging Features

Packaging Method : Semi-Hard Tray Assembly, Tray

Packaging Quantity : 20

Product Compliance

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