2134611-1
Wire-to-Board, 1 Position, Printed Circuit Board / Wire & Cable, Height 2.48 mm [.097 in], Surface Mount, 24 – 26 AWG Wire Size, Poke-In Connectors
2134611-1
Wire-to-Board, 1 Position, Printed Circuit Board / Wire & Cable, Height 2.48 mm [.097 in], Surface Mount, 24 – 26 AWG Wire Size, Poke-In Connectors
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- Buchanan WireMate
- TE Internal #: 2134611-1
- TE Internal Description: Micro poke in assembly
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Packaging Method : SMT Pocket Tape
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Operating Temperature Range : -25 – 130 °C [ -13 – 266 °F ]
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Primary Product Color : Natural
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PCB Contact Termination Area Plating Material Thickness : 3 µm [ 118.11 µin ]
Documents
Product Drawings
- MICRO POKE IN 1P ASSEMBLY ENG_CD_2134611_F.pdf English
CAD Files
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Download ECAD Model File
Download the free Library Loader to convert this file to your ECAD Tool. Learn more about the ECAD Model.
- 3D PDF 3D_CVM_CVM_2134611-1_J.pdf 3D
- Customer View Model ENG_CVM_CVM_2134611-1_J.2d_dxf.zip English
- ENG_CVM_CVM_2134611-1_J.3d_igs.zip English
- ENG_CVM_CVM_2134611-1_J.3d_stp.zip English
Datasheets & Catalog Pages
- Buchanan WireMate Micro Poke-In ENG_DS_7-1773460-1_BuchananWM_MicroPoke-In_0917.pdf English
- BUCHANAN WireMate Connectors Brochure CHI_DS_1-1773930-3_BuchananWM_Brochure_0917.pdf
- BUCHANAN WireMate Connectors Brochure ENG_DS_1-1773930-3_BuchananWM_Brochure_0917.pdf English
Product Specifications
- Application Specification JPN_SS_114-5482_D.pdf Japanese
- Product Specification JPN_SS_108-78810_A.pdf Japanese
Agency Approvals
- UL Report ENG_AAD_UL_E28476_20110301_B.pdf English
