2309409-1

Active

Small Outline (SO), 5.2 mm [.205 in] Stack Height, Right Angle Module Orientation, 260 Position, DDR4 DIMM, SO DIMM Sockets

2309409-1

Active

Small Outline (SO), 5.2 mm [.205 in] Stack Height, Right Angle Module Orientation, 260 Position, DDR4 DIMM, SO DIMM Sockets

- DDR4 DIMM

TE Internal #: 2309409-1
TE Internal Description: DDR4 SODIMM 260P 5.2H STD
All DDR4 SO DIMM Sockets (39)

DRAM Type : Small Outline (SO)
Stack Height : 5.2 mm [ .205 in ]
Module Orientation : Right Angle
Number of Positions : 260
Centerline (Pitch) (mm): 3.3, .5
Centerline (Pitch) (in): .129, .02

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Compatible Parts & Tooling

Documents

Product Drawings

DDR4 SODIMM SOCKET 0.5mm PITCH 260POS 5.2mm HEIGHT STANDARD TYPE ENG_CD_2309409_6.pdf English

CAD Files

Download ECAD Model File
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3D PDF 3D_CVM_CVM_2309409-1_1.pdf 3D
Customer View Model ENG_CVM_CVM_2309409-1_1.2d_dxf.zip English
ENG_CVM_CVM_2309409-1_1.3d_igs.zip English
ENG_CVM_CVM_2309409-1_1.3d_stp.zip English

Product Specifications

Application Specification ENG_SS_114-115015_A1.pdf English
Product Specification ENG_SS_108-115122_A2.pdf English

Product Change Notification

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Features

Please review product documents or contact us for the latest agency approval information.

Please Note: Use the Product Drawing for all design activity.

Product Type Features

Connector System : Cable-to-Board
Connector & Contact Terminates To : Printed Circuit Board
DRAM Type : Small Outline (SO)

Configuration Features

Number of Rows : 2
Number of Keys : 1
Module Orientation : Right Angle
Number of Positions : 260

Housing Features

Housing Color : Black
Housing Material : High Temperature Thermoplastic
Centerline (Pitch) (mm): 3.3, .5
Centerline (Pitch) (in): .129, .02

Body Features

Ejector Location : Both Ends
Ejector Type : Locking
Module Key Type : Offset Left
Latch Material : High Temperature Thermoplastic
Retention Post Location : Both Ends
Connector Profile : Low

Contact Features

PCB Contact Termination Area Plating Material : Gold Flash
Contact Base Material : Copper Alloy
Memory Socket Type : Memory Card
Contact Current Rating (Max) (A): .5
Contact Mating Area Plating Material : Gold Flash

Packaging Features

Packaging Quantity : 800
Packaging Method : Tape & Reel

Signal Characteristics

SGRAM Voltage (V): 1.2

Mechanical Attachment

PCB Mount Retention : With
Mating Alignment Type : Standard Keying
PCB Mount Retention Type : Solder Peg
Connector Mounting Type : Board Mount

Termination Features

Termination Method to PCB : Surface Mount
Insertion Style : Cam-In

Industry Standards

UL Flammability Rating : UL 94V-0

Electrical Characteristics

DRAM Voltage (V): 1.2

Dimensions

Stack Height : 5.2 mm [ .205 in ]
Row-to-Row Spacing : 8.2 mm [ .322 in ]

Usage Conditions

Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Operation/Application

Circuit Application : Power

Other

EU RoHS Compliance : Compliant
EU ELV Compliance : Compliant

2309409-1

Small Outline (SO), 5.2 mm [.205 in] Stack Height, Right Angle Module Orientation, 260 Position, DDR4 DIMM, SO DIMM Sockets

2309409-1

Small Outline (SO), 5.2 mm [.205 in] Stack Height, Right Angle Module Orientation, 260 Position, DDR4 DIMM, SO DIMM Sockets

DRAM Type : Small Outline (SO)

Stack Height : 5.2 mm [ .205 in ]

Module Orientation : Right Angle

Number of Positions : 260

Centerline (Pitch) (mm): 3.3, .5

Centerline (Pitch) (in): .129, .02

Documents

Product Drawings

CAD Files

Product Specifications

Product Change Notification

Features

Product Type Features

Connector System : Cable-to-Board

Connector & Contact Terminates To : Printed Circuit Board

DRAM Type : Small Outline (SO)

Configuration Features

Number of Rows : 2

Number of Keys : 1

Module Orientation : Right Angle

Number of Positions : 260

Housing Features

Housing Color : Black

Housing Material : High Temperature Thermoplastic

Centerline (Pitch) (mm): 3.3, .5

Centerline (Pitch) (in): .129, .02

Body Features

Ejector Location : Both Ends

Ejector Type : Locking

Module Key Type : Offset Left

Latch Material : High Temperature Thermoplastic

Retention Post Location : Both Ends

Connector Profile : Low

Contact Features

PCB Contact Termination Area Plating Material : Gold Flash

Contact Base Material : Copper Alloy

Memory Socket Type : Memory Card

Contact Current Rating (Max) (A): .5

Contact Mating Area Plating Material : Gold Flash

Packaging Features

Packaging Quantity : 800

Packaging Method : Tape & Reel

Signal Characteristics

SGRAM Voltage (V): 1.2

Mechanical Attachment

PCB Mount Retention : With

Mating Alignment Type : Standard Keying

PCB Mount Retention Type : Solder Peg

Connector Mounting Type : Board Mount

Termination Features

Termination Method to PCB : Surface Mount

Insertion Style : Cam-In

Industry Standards

UL Flammability Rating : UL 94V-0

Electrical Characteristics

DRAM Voltage (V): 1.2

Dimensions

Stack Height : 5.2 mm [ .205 in ]

Row-to-Row Spacing : 8.2 mm [ .322 in ]

Usage Conditions

Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Operation/Application

Circuit Application : Power

Other

EU RoHS Compliance : Compliant

EU ELV Compliance : Compliant

Product Compliance