Please review product documents or contact us for the latest agency approval information. 

Please Note: Use the Product Drawing for all design activity. 

• DRAM Type : Small Outline (SO)

• Connector System : Cable-to-Board

• Connector & Contact Terminates To : Printed Circuit Board

• Stack Height : 5.2 mm [ .205 in ]

• Row-to-Row Spacing : 8.2 mm [ .322 in ]

• Module Orientation : Right Angle

• Number of Positions : 200, 260

• Number of Rows : 2

• Number of Keys : 1

• Centerline (Pitch) : .5 mm [ .02 in ]

• Housing Color : Black

• Housing Material : High Temperature Thermoplastic

• Connector Profile : Low

• Ejector Location : Both Ends

• Ejector Type : Locking

• Latch Material : High Temperature Thermoplastic

• Retention Post Material : Copper Alloy

• Retention Post Location : Both Ends

• Contact Mating Area Plating Material : Gold

• Contact Mating Area Plating Material Thickness : .254 µm [ 10 µin ]

• PCB Contact Termination Area Plating Material : Gold Flash

• Contact Base Material : Copper Alloy

• Memory Socket Type : Memory Card

• Contact Underplating Material : Nickel

• Contact Current Rating (Max) (A): .5

• Packaging Method : Tape & Reel

• Packaging Quantity : 800

• Circuit Application : Power

• Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

• EU RoHS Compliance : Compliant

• EU ELV Compliance : Compliant

• DRAM Voltage (V): 1.2

• SGRAM Voltage (V): 1.2

• Termination Method to PCB : Surface Mount

• Insertion Style : Cam-In

• PCB Mount Retention : With

• Mating Alignment Type : Reverse Keying

• PCB Mount Retention Type : Solder Peg

• Connector Mounting Type : Board Mount