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2309412-2

Active

Small Outline (SO), Stack Height 8 mm [.315 in], Right Angle Module Orientation, 260 Position, .5 mm [.02 in] Centerline, DDR4 DIMM, SO DIMM Sockets

2309412-2

Active

Small Outline (SO), Stack Height 8 mm [.315 in], Right Angle Module Orientation, 260 Position, .5 mm [.02 in] Centerline, DDR4 DIMM, SO DIMM Sockets

- DDR4 DIMM

TE Internal #: 2309412-2
TE Internal Description: DDR4 SODIMM 260P 8.0H RVS
All DDR4 SO DIMM Sockets (39)

DRAM Type : Small Outline (SO)
Stack Height : 8 mm [ .315 in ]
Module Orientation : Right Angle
Number of Positions : 260
Centerline (Pitch) : .5 mm [ .02 in ]

See All Features

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Compatible Parts & Tooling

Documents

Product Drawings

DDR4 SODIMM SOCKET 0.5mm PITCH 260POS 8.0mm HEIGHT REVERSE TYPE ENG_CD_2309412_5.pdf English

CAD Files

Download ECAD Model File
Download the free Library Loader to convert this file to your ECAD Tool. Learn more about the ECAD Model.
3D PDF 3D_CVM_CVM_2309412-2_1.pdf 3D
Customer View Model ENG_CVM_CVM_2309412-2_1.2d_dxf.zip English
ENG_CVM_CVM_2309412-2_1.3d_igs.zip English
ENG_CVM_CVM_2309412-2_1.3d_stp.zip English

Product Specifications

Application Specification ENG_SS_114-115015_A1.pdf English
Product Specification ENG_SS_108-115122_A2.pdf English
Qualification Test Report ENG_SS_501-115136_B.pdf English

Product Change Notification

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Features

Please review product documents or contact us for the latest agency approval information.

Please Note: Use the Product Drawing for all design activity.

Product Type Features

DRAM Type : Small Outline (SO)
Connector System : Cable-to-Board
Connector & Contact Terminates To : Printed Circuit Board

Dimensions

Stack Height : 8 mm [ .315 in ]
Row-to-Row Spacing : 8.2 mm [ .322 in ]

Configuration Features

Module Orientation : Right Angle
Number of Positions : 260
Number of Rows : 2
Number of Keys : 1

Housing Features

Centerline (Pitch) : .5 mm [ .02 in ]
Housing Color : Black
Housing Material : High Temperature Thermoplastic

Body Features

Connector Profile : High
Ejector Location : Both Ends
Ejector Type : Locking
Module Key Type : Offset Right
Latch Material : High Temperature Thermoplastic
Retention Post Material : Stainless Steel
Retention Post Location : Both Ends

Contact Features

Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : .127 µm [ 5 µin ]
PCB Contact Termination Area Plating Material : Gold Flash
Contact Base Material : Copper Alloy
Memory Socket Type : Memory Card
Contact Underplating Material : Nickel
Contact Current Rating (Max) (A): .5

Packaging Features

Packaging Method : Tape & Reel
Packaging Quantity : 500

Operation/Application

Circuit Application : Power

Usage Conditions

Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Other

EU RoHS Compliance : Compliant
EU ELV Compliance : Compliant

Electrical Characteristics

DRAM Voltage (V): 1.2

Signal Characteristics

SGRAM Voltage (V): 1.2

Termination Features

Termination Method to PCB : Surface Mount
Insertion Style : Cam-In

Mechanical Attachment

PCB Mount Retention : With
Mating Alignment Type : Reverse Keying
PCB Mount Retention Type : Solder Peg
Connector Mounting Type : Board Mount

Industry Standards

UL Flammability Rating : UL 94V-0

2309412-2

Small Outline (SO), Stack Height 8 mm [.315 in], Right Angle Module Orientation, 260 Position, .5 mm [.02 in] Centerline, DDR4 DIMM, SO DIMM Sockets

2309412-2

Small Outline (SO), Stack Height 8 mm [.315 in], Right Angle Module Orientation, 260 Position, .5 mm [.02 in] Centerline, DDR4 DIMM, SO DIMM Sockets

DRAM Type : Small Outline (SO)

Stack Height : 8 mm [ .315 in ]

Module Orientation : Right Angle

Number of Positions : 260

Centerline (Pitch) : .5 mm [ .02 in ]

Documents

Product Drawings

CAD Files

Product Specifications

Product Change Notification

Features

Product Type Features

DRAM Type : Small Outline (SO)

Connector System : Cable-to-Board

Connector & Contact Terminates To : Printed Circuit Board

Dimensions

Stack Height : 8 mm [ .315 in ]

Row-to-Row Spacing : 8.2 mm [ .322 in ]

Configuration Features

Module Orientation : Right Angle

Number of Positions : 260

Number of Rows : 2

Number of Keys : 1

Housing Features

Centerline (Pitch) : .5 mm [ .02 in ]

Housing Color : Black

Housing Material : High Temperature Thermoplastic

Body Features

Connector Profile : High

Ejector Location : Both Ends

Ejector Type : Locking

Module Key Type : Offset Right

Latch Material : High Temperature Thermoplastic

Retention Post Material : Stainless Steel

Retention Post Location : Both Ends

Contact Features

Contact Mating Area Plating Material : Gold

Contact Mating Area Plating Material Thickness : .127 µm [ 5 µin ]

PCB Contact Termination Area Plating Material : Gold Flash

Contact Base Material : Copper Alloy

Memory Socket Type : Memory Card

Contact Underplating Material : Nickel

Contact Current Rating (Max) (A): .5

Packaging Features

Packaging Method : Tape & Reel

Packaging Quantity : 500

Operation/Application

Circuit Application : Power

Usage Conditions

Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Other

EU RoHS Compliance : Compliant

EU ELV Compliance : Compliant

Electrical Characteristics

DRAM Voltage (V): 1.2

Signal Characteristics

SGRAM Voltage (V): 1.2

Termination Features

Termination Method to PCB : Surface Mount

Insertion Style : Cam-In

Mechanical Attachment

PCB Mount Retention : With

Mating Alignment Type : Reverse Keying

PCB Mount Retention Type : Solder Peg

Connector Mounting Type : Board Mount

Industry Standards

UL Flammability Rating : UL 94V-0

Product Compliance