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2309413-5

Active

Small Outline (SO), Stack Height 9.2 mm [.362 in], Right Angle Module Orientation, 260 Position, .5 mm [.02 in] Centerline, DDR4 DIMM, SO DIMM Sockets

2309413-5

Active

Small Outline (SO), Stack Height 9.2 mm [.362 in], Right Angle Module Orientation, 260 Position, .5 mm [.02 in] Centerline, DDR4 DIMM, SO DIMM Sockets

- DDR4 DIMM

TE Internal #: 2309413-5
TE Internal Description: DDR4 SODIMM 260P 9.2H STD
All DDR4 SO DIMM Sockets (39)

DRAM Type : Small Outline (SO)
Stack Height : 9.2 mm [ .362 in ]
Module Orientation : Right Angle
Number of Positions : 260
Centerline (Pitch) : .5 mm [ .02 in ]

See All Features

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Compatible Parts & Tooling

Documents

Product Drawings

DDR4 SODIMM SOCKET 0.5mm PITCH 260POS 9.2mm HEIGHT STANDARD TYPE ENG_CD_2309413_7.pdf English

CAD Files

Download ECAD Model File
Download the free Library Loader to convert this file to your ECAD Tool. Learn more about the ECAD Model.
3D PDF 3D_CVM_CVM_2309413-5_1.pdf 3D
Customer View Model ENG_CVM_CVM_2309413-5_1.2d_dxf.zip English
ENG_CVM_CVM_2309413-5_1.3d_igs.zip English
ENG_CVM_CVM_2309413-5_1.3d_stp.zip English

Product Specifications

Application Specification ENG_SS_114-115015_A1.pdf English
Product Specification ENG_SS_108-115122_A2.pdf English
Qualification Test Report ENG_SS_501-115136_B.pdf English

Product Change Notification

View Product Change Notification Login required to access product change notifications

Features

Please review product documents or contact us for the latest agency approval information.

Please Note: Use the Product Drawing for all design activity.

Product Type Features

DRAM Type : Small Outline (SO)
Connector System : Cable-to-Board
Connector & Contact Terminates To : Printed Circuit Board

Dimensions

Stack Height : 9.2 mm [ .362 in ]
Row-to-Row Spacing : 8.2 mm [ .322 in ]

Configuration Features

Module Orientation : Right Angle
Number of Positions : 260
Number of Rows : 2
Number of Keys : 1

Housing Features

Centerline (Pitch) : .5 mm [ .02 in ]
Housing Color : Black
Housing Material : High Temperature Thermoplastic

Body Features

Connector Profile : High
Ejector Location : Both Ends
Ejector Type : Locking
Module Key Type : Offset Left
Latch Material : High Temperature Thermoplastic
Retention Post Material : Stainless Steel
Retention Post Location : Both Ends

Contact Features

Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : .76 µm [ 30 µin ]
PCB Contact Termination Area Plating Material : Gold Flash
Contact Base Material : Copper Alloy
Memory Socket Type : Memory Card
Contact Underplating Material : Nickel
Contact Current Rating (Max) (A): .5

Packaging Features

Packaging Method : Tape & Reel
Packaging Quantity : 500

Operation/Application

Circuit Application : Power

Usage Conditions

Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Other

EU RoHS Compliance : Compliant
EU ELV Compliance : Compliant

Electrical Characteristics

DRAM Voltage (V): 1.2

Signal Characteristics

SGRAM Voltage (V): 1.2

Termination Features

Termination Method to PCB : Surface Mount
Insertion Style : Cam-In

Mechanical Attachment

PCB Mount Retention : With
Mating Alignment Type : Standard Keying
PCB Mount Retention Type : Solder Peg
Connector Mounting Type : Board Mount

Industry Standards

UL Flammability Rating : UL 94V-0

2309413-5

Small Outline (SO), Stack Height 9.2 mm [.362 in], Right Angle Module Orientation, 260 Position, .5 mm [.02 in] Centerline, DDR4 DIMM, SO DIMM Sockets

2309413-5

Small Outline (SO), Stack Height 9.2 mm [.362 in], Right Angle Module Orientation, 260 Position, .5 mm [.02 in] Centerline, DDR4 DIMM, SO DIMM Sockets

DRAM Type : Small Outline (SO)

Stack Height : 9.2 mm [ .362 in ]

Module Orientation : Right Angle

Number of Positions : 260

Centerline (Pitch) : .5 mm [ .02 in ]

Documents

Product Drawings

CAD Files

Product Specifications

Product Change Notification

Features

Product Type Features

DRAM Type : Small Outline (SO)

Connector System : Cable-to-Board

Connector & Contact Terminates To : Printed Circuit Board

Dimensions

Stack Height : 9.2 mm [ .362 in ]

Row-to-Row Spacing : 8.2 mm [ .322 in ]

Configuration Features

Module Orientation : Right Angle

Number of Positions : 260

Number of Rows : 2

Number of Keys : 1

Housing Features

Centerline (Pitch) : .5 mm [ .02 in ]

Housing Color : Black

Housing Material : High Temperature Thermoplastic

Body Features

Connector Profile : High

Ejector Location : Both Ends

Ejector Type : Locking

Module Key Type : Offset Left

Latch Material : High Temperature Thermoplastic

Retention Post Material : Stainless Steel

Retention Post Location : Both Ends

Contact Features

Contact Mating Area Plating Material : Gold

Contact Mating Area Plating Material Thickness : .76 µm [ 30 µin ]

PCB Contact Termination Area Plating Material : Gold Flash

Contact Base Material : Copper Alloy

Memory Socket Type : Memory Card

Contact Underplating Material : Nickel

Contact Current Rating (Max) (A): .5

Packaging Features

Packaging Method : Tape & Reel

Packaging Quantity : 500

Operation/Application

Circuit Application : Power

Usage Conditions

Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Other

EU RoHS Compliance : Compliant

EU ELV Compliance : Compliant

Electrical Characteristics

DRAM Voltage (V): 1.2

Signal Characteristics

SGRAM Voltage (V): 1.2

Termination Features

Termination Method to PCB : Surface Mount

Insertion Style : Cam-In

Mechanical Attachment

PCB Mount Retention : With

Mating Alignment Type : Standard Keying

PCB Mount Retention Type : Solder Peg

Connector Mounting Type : Board Mount

Industry Standards

UL Flammability Rating : UL 94V-0

Product Compliance