Please review product documents or contact us for the latest agency approval information. 

Please Note: Use the Product Drawing for all design activity. 

• PCB Thickness (Recommended) : .79 – 3.18 mm [ .031 – .125 in ]

• Socket Length : 3.63 mm [ .143 in ]

• PCB Hole Diameter : 1.83 mm [ .072 in ]

• Wire Size (AWG): 20 – 21

• Wire Size (mm²): .41 – .518

• Mating Pin Diameter Range : .76 – .84 mm [ .03 – .033 in ]

• Connector & Contact Terminates To : Printed Circuit Board

• Socket Sleeve Style : Closed Bottom

• Connector System : Cable-to-Board

• Sealable : No

• Contact Spring Plating Thickness : .762 µm [ 30 µin ]

• Contact Mating Area Plating Material Thickness : 30 µm [ 30 µin ]

• Contact Base Material : Beryllium Copper

• Contact Spring Plating Material : Gold

• Contact Current Rating (Max) (A): 6.5

• Solder Process Feature : None

• Circuit Application : Power & Signal

• Spring Material : Beryllium Copper

• EU RoHS Compliance : Compliant

• EU ELV Compliance : Compliant

• Packaging Quantity : 2000

• Packaging Method : Loose Piece, Bag

• Sleeve Material : Copper

• Sleeve Plating Material : Gold Flash over Nickel

• Insertion Method : Hand/Semi-Automatic

• Termination Method to Wire & Cable : Solder

• Termination Method to PCB : Through Hole - Press-Fit

• Compatible With Wire & Cable Type : Discrete Wire