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Our LGA 3647 socket is designed for Intel’s next-generation CPU processors. The new socket allows designers to take advantage of the higher performance, better system application scaling processors. The LGA 3647 socket is the first to feature a two-piece design that reduces warping and offers better coplanarity for improved reliability. As a validated suppliers of this technology, TE is your dependable, high-quality source for this new CPU processor socket.
After an intense five-month contest against 74 major electronics suppliers, TE's LGA 3647 socket was recently awarded Best Passive Component at the EEPW (Electronic Engineering & Product World) 2016 Editors' Choice Awards – selected by more than 2,000 industry insiders.
LGA 3647 Socket and Hardware
We are a validated supplier of LGA 3647 Socket hardware including back plates, bolster plates, and clips/carriers for Socket P0. With a narrow fabric and a narrow non-fabric offering, this new hardware system provides better alignment and keeps fingers away from the socket contact field.
TE’s new LGA 3647 socket and hardware allows designers to take advantage of Intel’s new high performance processors that also offer better system scaling.
LGA Sockets
LGA sockets are the latest socket technology for Intel- and AMD-based LGA microprocessor packages that range in size up to 3647 pins. This generation of LGA sockets provides a compressive electrical interface to the microprocessor package and are solder ball, surface mount attached to the PCB. The stainless steel load plate provides a reliable interconnection to the microprocessor package with a single lever handle for package actuation. The contact tip geometry is optimized to reduce risk of contact damage during handling and package installation.
Please review product documents or contact us for the latest agency approval information.
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