ELSFP Product Video
Support for 102.4T CPO systems with ELSFP
Our External Laser Small Form-Factor Pluggable (ELSFP) product is a faceplate pluggable form-factor to address the laser packaging requirements for 102.4T co-packaged optical (CPO) systems with optical engines (OEs) according to OIF-ELSFP-01.0 implementation agreement. The ELSFP product is targeted primarily at CPO applications, which may include but are not limited to the use of external lasers to provide optical power to the OEs incorporated in switches, network interface cards, artificial intelligent (AI) and machine learning application specific integrated circuits (ASICs).
Key Benefits
Faceplate pluggable form-factor for 102.4T co-packaged optical (CPO) systems
- Meet ELSFP Implementation Agreement (IA) with a multi-sourced future-proof panel pluggable external laser source form-factor to address the evolving needs of the industry
- Targets primarily at CPO applications, which may include but are not limited to the use of external lasers to provide optical power to the OEs
A more efficient cooling solution system
- By placing the ELSFP at the faceplate of CPO systems (removed from the heat of the co-package ASICs and OEs) a more efficient cooling solution can be designed for these systems
Reliably provide a replaceable light source package (hot Swap)
- Greater reliability is achieved with the fail-safe of a field replaceable pluggable module in case of a laser failure
Eye safety is achieved by a blind mate optical connector
- Blind-mate optical connector can mitigate potential eye safety risks, particularly in high optical powers applications
Target Applications
- Co-packaged optical (CPO) System
- Network Interface Card
- Swithces
- Storages
