Imaging and Microelectronic Packaging

Core Technologies

TE Connectivity offers global sensor manufacturing services for your design needs including clean room production, rapid prototyping to small serial up to mass production on fully automated production lines.

Capabilities

The Sensor Manufacturing Services (SMS) team at TE Connectivity can provide the expertise with materials and interconnections excellence for full, turnkey solutions from small series to several million pieces. We provide design-to-manufacture, design-to-assembly, feasibility studies, design verification and protyping. Our facilities are certified to ISO 9001, ISO 13485, IATF 16949, ISO 9100, and ISO 14001 standards.

Imager Packaging

Large imagers in a cleanroom up to ISO5. Deep material process knowledge that is optimized for extremely low particle count, 2-5µm position accuracy and low warpage with less than 35µm flatness.
Large arrays are yield optimized high fill-factor tiles with matrix arrays of CT/MRT/PET applications. Experience with flip chip, TSV, radiation hardness, and non-magnetic materials.
Automated processes for miniature optoelectronic assemblies that are augmented by manual capabilities where necessary.

Development Team

Board-level and module simulation
- Mechanical simulation (warpage, flatness, distortion)
- Thermal simulation
Design and materials
- Electric layout, design optimization
- Mechanic design optimization
- Extensive material and process knowledge
Testing and qualification
- Environmental
- Final test development

Core Technologies

Singulation

SI wafer up to 300mm diameter (2“-12“)

Wafer mounting onto dicing film; DDAF (Dicing Die Attach Film) optional

Incoming inspection with wafer microscope; manual or automated processing; wafer map alignment

Outgoing inspection

Wafer with µLenses have special process to ensure cleanliness (dicing residue)

Cleaning post dicing process

Substrate singulation also part of portfolio

Die Bonding

Dies in ceramic packages covered by glass lids or filter-glass under cleanroom conditions (class 100/ ISO 5)

Dies within COB process, bonded on PCB

High die placement accuracy is key

Minimal die warpage can be achieved e.g., 84x11mm die -> <25µm warpage

Optimized thermal management for usage and further processing (e.g. soldering of lead fingers)

High reliability requirements regarding lifetime; tested by temperature cycles and temperature storage

Wire Bonding

Thinwire 15-50µm bonding

Gold wirebonds

Specialized loop capability

Staggered wirebonding capability

Wire pull- and wire shear test as standard approach

Reliability and environmental test capability

Heavy wire bonding (up to 380 µm)

Frame Attach / Glob Top / Hermetic Encapsulation

Dies on COB substrate (PCB) covered by glass-frame combinations or filter-glass

Dies on COB substrate to be covered with metal cap/ plastic cap/ glob top/ conformal coating

Substrate optimized die warpage/cover attach

Hermetic encapsulation for harsh environment applications

Cost efficient approach for sensors

Replacing individual ceramic packages as sensor board solution on PCB

Fitting reliability requirements (PCB to PCB) regarding lifetime; tested by temperature cycles and temperature storage

Calibration & Testing

Calibration services

Optical alignments

Qualification and reliability testing

Simulations, e.g. temperature distribution

Application Expertise

Industrial

Components and Applications

Line scan imaging: custom high end machine vision camera board
Area scan imaging: custom packaging of small to large image sensors
Time of Flight (ToF) imaging: custom packaging of industrial ToF camera board

Medical

Components and Applications

Digital imaging:

PET-sensor array
Endoscopic image sensor

Image signal processing: line driver ASIC assembly flat panel x-ray

Transportation

Components and Applications

Pressure sensors
Torque/steering sensors
Avalanche photodiodes / matrix arrays