TE Connectivity (TE)
TE Connectivity (TE)
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Solutions for Low Power T&C - MCON & HPF (English)
This presentation will showcase how TE is addressing the challenges of the Low Power T&C products as: - Increasing Pin count - Mating Forces - Increased Vibration profiles - Increased Operating temperatures TEs portfolio and technology solutions for the low power interfaces widely used Automotive applications offer distinctive solutions to address the customer challenges of today.
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