Industry Tradeshow
DesignCon 2024
Join us in Booth #913 to learn more about how TE is helping to empower the AI and ML evolution.
January 30, 2024 - February 1, 2024
Santa Clara Convention Center
Santa Clara, CA
Reinventing Copper for the Next Generation of AI
TE Connectivity (TE) is addressing 224G and PCIe Gen 6 signal integrity challenges for the next generation of AI systems through close collaboration with customers and silicon partners in the development of new technologies. Continuing to extend the value of copper, through the socket, over the board, and between the nodes, with a combination of passive and active copper cabling solutions
TE’s next generation 224G products and industry leading PCIe/CXL portfolio are backed by an extensive range of power and cooling cables and connectors that provide faster, cooler, and more agile solutions for hyperscale data center and enterprise customers, driving the future of artificial intelligence (AI) and machine learning (ML). At the forefront of data connectivity, TE provides cutting-edge solutions to meet today’s processing needs and anticipate tomorrow’s forward-thinking designs.
TE Expert Talks at DesignCon 2024
- Panel: Reining in Power Consumption Trends for Next Generation Optical Networking
- Nathan Tracy, Technologist - System Architecture, TE Connectivity; President, OIF
- Panel: OIF Update on 224 Gbps Common Electrical Interfaces (CEI) Development
- Nathan Tracy, Technologist - System Architecture, TE Connectivity; President, OIF
- Nathan Tracy, Technologist - System Architecture, TE Connectivity; President, OIF
Demos & Displays
Product solutions on display at DesignCon 2024
- 224G Architectures Enabling AI & Networking: Increases in bandwidth density and adoption of higher speed protocols are putting constraints on switch and AI accelerator architectures. Cabling high speed signal from I/O ports or backplanen to near-chip can help relieve some of these constraints. In this live demo, TE is showcasing a cabled backplane architecture plus OTB near-chip solution, utilizing AdrenaLINE Catapult cable-to-board and AdrenaLINE Slingshot cable-to-cable and cable-to-R/A-PCB connector systems. The demo is being driven by Marvell's 224 Gbps silicon.
- 112G Side Stacked Mezzanine: TE's stackable, hermaphroditic BGA side stacked mezzanine connector offers a high density and high speed connection to address the needs of increased bandwidth and higher power density for a variety of applications. With superior signal integrity performance, the side stacked connector supports 112G PAM4 and PCIe Gen 5/6, with extremely low crosstalk and resonance support.
- PCIe Gen 6 CDFP Passive Copper Cable Solutions: AI/ML are accelerating the demand for high-performance, high-density, and low-latency interconnect solutions. Disaggregated architectures increase the demand for external copper cabling that can run next-gen PCIe Gen 6 and CXL protocols. In this live demo, TE will demonstrate a CDFP 4m+ passive copper cable running at 64GT/s (PCIe Gen 6) driven by Marvell’s 5nm PCIe Gen 6 SerDes.
- External PCIe Cabling: Next Generation Architectures for CXL Switching and Disaggregated Memory : Next generation system architectures demand improvements in efficiency to help drive cost and performance optimizations. Disaggregated and composable architectures enable the use of pooled resources like compute, memory, hardware acceleration and storage, and allow these resources to be utilized dynamically when they are needed. These disaggregated architectures leverage external PCIe cabling in the industry standard form factor CDFP. TE's system mockups demonstrate applications like CXL switching, disaggregated memory modules, and PCIe retimer cards enabled by CDFP connectors and cables.
- PCIe Gen 6 Architectures with Cabled Solutions : With the growing need for channel margin and overall channel flexibility, TE’s PCIe Gen6 cabled receptacles can offer improved SI performance with traditional surface mount type or direct to lead frame cable alternatives, which won’t be impacted by motherboard thickness. TE’s portfolio of mechanically robust interfaces help enable modular design options for the end user to simplify their design choices. TE’s solutions can adapt to interface with industry-wide form factors such as PCIe-CEM, EDSFF, OCP NIC 3.0, and DC-SCM and leverage our continuously growing portfolio including Sliver, MCIO, M-XIO, and LPSS connectors and cable assemblies.
- Power Distribution for Data Center Rack: TE's power solutions for data center rack showcases the latest power distribution products addressing 12V system and 48V next generation system architectures' demand for higher power distribution solutions to support cost effectiveness, safety, high/low volume production, and reliability.
- Smart Busbar Connector for Server Racks: Power connectors inside server racks may undergo temperature-related failures, causing service disruption. Outfitting power connectors with sensors enables real-time monitoring of their condition, alowing careful overdriving and planned repairs. Through thermal characterization of busbar power connectors and measurements of the RF communication channels, a prototype smart busbar connector was developed. The demonstration kit highlights this effort in a live, visual format for expo-goers to enjoy. A touchscreen interface provides controls for heating a sample busbar and graphs temperature data, measured from the smart busbar connectors.
- Liquid Cooled Power Busbar Assembly: In partnership with Cooler Master, TE is enabling the next-gen power busbar solutions helping to empower the AI evoluiton. As rack level power requirements continue to increase, power busbar capacities need to follow suit. The use of liquid cooled infrastructures to cool the power busbars allows for higher current capacities while maintaining lower temperatures.
- EMI Shielding for Data Centers: Network equipment manufacturers need to consider Electromagnetic Compatibility as a potential inhibitor to maximize speed and efficiency in data centers. As architectures continue to evolve, engineers will need to meet the challenges of designing for faster data speeds, increased connectivity, and higher frequencies.
Industry Tradeshow
DesignCon 2024
Join us in Booth #913 to learn more about how TE is helping to empower the AI and ML evolution.
January 30, 2024 - February 1, 2024
Santa Clara Convention Center
Santa Clara, CA
Reinventing Copper for the Next Generation of AI
TE Connectivity (TE) is addressing 224G and PCIe Gen 6 signal integrity challenges for the next generation of AI systems through close collaboration with customers and silicon partners in the development of new technologies. Continuing to extend the value of copper, through the socket, over the board, and between the nodes, with a combination of passive and active copper cabling solutions
TE’s next generation 224G products and industry leading PCIe/CXL portfolio are backed by an extensive range of power and cooling cables and connectors that provide faster, cooler, and more agile solutions for hyperscale data center and enterprise customers, driving the future of artificial intelligence (AI) and machine learning (ML). At the forefront of data connectivity, TE provides cutting-edge solutions to meet today’s processing needs and anticipate tomorrow’s forward-thinking designs.
TE Expert Talks at DesignCon 2024
- Panel: Reining in Power Consumption Trends for Next Generation Optical Networking
- Nathan Tracy, Technologist - System Architecture, TE Connectivity; President, OIF
- Panel: OIF Update on 224 Gbps Common Electrical Interfaces (CEI) Development
- Nathan Tracy, Technologist - System Architecture, TE Connectivity; President, OIF
- Nathan Tracy, Technologist - System Architecture, TE Connectivity; President, OIF
Demos & Displays
Product solutions on display at DesignCon 2024
- 224G Architectures Enabling AI & Networking: Increases in bandwidth density and adoption of higher speed protocols are putting constraints on switch and AI accelerator architectures. Cabling high speed signal from I/O ports or backplanen to near-chip can help relieve some of these constraints. In this live demo, TE is showcasing a cabled backplane architecture plus OTB near-chip solution, utilizing AdrenaLINE Catapult cable-to-board and AdrenaLINE Slingshot cable-to-cable and cable-to-R/A-PCB connector systems. The demo is being driven by Marvell's 224 Gbps silicon.
- 112G Side Stacked Mezzanine: TE's stackable, hermaphroditic BGA side stacked mezzanine connector offers a high density and high speed connection to address the needs of increased bandwidth and higher power density for a variety of applications. With superior signal integrity performance, the side stacked connector supports 112G PAM4 and PCIe Gen 5/6, with extremely low crosstalk and resonance support.
- PCIe Gen 6 CDFP Passive Copper Cable Solutions: AI/ML are accelerating the demand for high-performance, high-density, and low-latency interconnect solutions. Disaggregated architectures increase the demand for external copper cabling that can run next-gen PCIe Gen 6 and CXL protocols. In this live demo, TE will demonstrate a CDFP 4m+ passive copper cable running at 64GT/s (PCIe Gen 6) driven by Marvell’s 5nm PCIe Gen 6 SerDes.
- External PCIe Cabling: Next Generation Architectures for CXL Switching and Disaggregated Memory : Next generation system architectures demand improvements in efficiency to help drive cost and performance optimizations. Disaggregated and composable architectures enable the use of pooled resources like compute, memory, hardware acceleration and storage, and allow these resources to be utilized dynamically when they are needed. These disaggregated architectures leverage external PCIe cabling in the industry standard form factor CDFP. TE's system mockups demonstrate applications like CXL switching, disaggregated memory modules, and PCIe retimer cards enabled by CDFP connectors and cables.
- PCIe Gen 6 Architectures with Cabled Solutions : With the growing need for channel margin and overall channel flexibility, TE’s PCIe Gen6 cabled receptacles can offer improved SI performance with traditional surface mount type or direct to lead frame cable alternatives, which won’t be impacted by motherboard thickness. TE’s portfolio of mechanically robust interfaces help enable modular design options for the end user to simplify their design choices. TE’s solutions can adapt to interface with industry-wide form factors such as PCIe-CEM, EDSFF, OCP NIC 3.0, and DC-SCM and leverage our continuously growing portfolio including Sliver, MCIO, M-XIO, and LPSS connectors and cable assemblies.
- Power Distribution for Data Center Rack: TE's power solutions for data center rack showcases the latest power distribution products addressing 12V system and 48V next generation system architectures' demand for higher power distribution solutions to support cost effectiveness, safety, high/low volume production, and reliability.
- Smart Busbar Connector for Server Racks: Power connectors inside server racks may undergo temperature-related failures, causing service disruption. Outfitting power connectors with sensors enables real-time monitoring of their condition, alowing careful overdriving and planned repairs. Through thermal characterization of busbar power connectors and measurements of the RF communication channels, a prototype smart busbar connector was developed. The demonstration kit highlights this effort in a live, visual format for expo-goers to enjoy. A touchscreen interface provides controls for heating a sample busbar and graphs temperature data, measured from the smart busbar connectors.
- Liquid Cooled Power Busbar Assembly: In partnership with Cooler Master, TE is enabling the next-gen power busbar solutions helping to empower the AI evoluiton. As rack level power requirements continue to increase, power busbar capacities need to follow suit. The use of liquid cooled infrastructures to cool the power busbars allows for higher current capacities while maintaining lower temperatures.
- EMI Shielding for Data Centers: Network equipment manufacturers need to consider Electromagnetic Compatibility as a potential inhibitor to maximize speed and efficiency in data centers. As architectures continue to evolve, engineers will need to meet the challenges of designing for faster data speeds, increased connectivity, and higher frequencies.
