Please review product documents or contact us for the latest agency approval information. 

Please Note: Use the Product Drawing for all design activity. 

• Connector System : Cable-to-Board

• Connector & Contact Terminates To : Printed Circuit Board

• DRAM Type : Double Data Rate (DDR) 2

• Number of Rows : 2

• Number of Keys : 1

• Number of Bays : 2

• Module Orientation : Right Angle

• Number of Positions : 200

• Housing Color : Black

• Housing Material : High Temperature Thermoplastic

• Centerline (Pitch) : .6 mm [ .024 in ]

• Ejector Location : Both Ends

• Ejector Type : Locking

• Module Key Type : SGRAM

• Latch Material : Stainless Steel

• Latch Plating Material : Tin

• Connector Profile : Standard

• PCB Contact Termination Area Plating Material : Gold Flash

• Contact Base Material : Copper Alloy

• Memory Socket Type : Memory Card

• Contact Current Rating (Max) (A): .5

• Contact Mating Area Plating Material : Gold Flash

• Packaging Quantity : 20

• Packaging Method : Semi-Hard Tray Assembly

• SGRAM Voltage (V): 1.8

• PCB Mount Retention : With

• Mating Alignment Type : Reverse Keying

• PCB Mount Retention Type : Solder Peg

• Connector Mounting Type : Board Mount

• Termination Method to PCB : Surface Mount

• Insertion Style : Cam-In

• UL Flammability Rating : UL 94V-0

• DRAM Voltage (V): 1.8

• Stack Height : 5.2 mm [ .205 in ]

• Row-to-Row Spacing : 6.2 mm [ .244 in ]

• Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

• Circuit Application : Power