designcon 2021

Industry Tradeshow

DesignCon 2023

Enabling Next Gen Architectures

January 31, 2023 - February 2, 2023

Santa Clara Convention Center

Santa Clara, CA | USA

DesignCon 2023 Demos

Click to watch our innovative solutions we presented at DesignCon 2023.

800G Active Cables (AOC, AEC, ACC)

Click to watch our 800G OSFP active copper cable (ACC) demonstrate the latest in TE’s bulk cable and termination technology.

800G Active Cables (AOC, AEC, ACC)

Click to watch our 800G OSFP active copper cable (ACC) demonstrate the latest in TE’s bulk cable and termination technology.

224G Architectures Enabling AI & Networking

Click to watch our 224G Gbps AdrenaLINE Catapult near-chip connector enable Over-The-Board (OTB) pluggable IO ports as well as cabled backplane systems (AdrenaLINE Slingshot). 

224G Architectures Enabling AI & Networking

Click to watch our 224G Gbps AdrenaLINE Catapult near-chip connector enable Over-The-Board (OTB) pluggable IO ports as well as cabled backplane systems (AdrenaLINE Slingshot). 

Next-Gen PCIe Architectures With Cabled Riser Solutions

Click to watch our cabled riser technology enable next levels of system configurability and modularity for system architects and designers.

Next-Gen PCIe Architectures With Cabled Riser Solutions

Click to watch our cabled riser technology enable next levels of system configurability and modularity for system architects and designers.

1.6TB OSFP 1 meter Passive Copper Cable

Click to watch our latest cable technologies and OSFP connector design along with advanced termination techniques and advanced PCB laminates. Here we are demonstrating this with Intel’s 224G PHY test chip and our OSFP224G Passive Direct Attach Cable (DAC).

1.6TB OSFP 1 meter Passive Copper Cable

Click to watch our latest cable technologies and OSFP connector design along with advanced termination techniques and advanced PCB laminates. Here we are demonstrating this with Intel’s 224G PHY test chip and our OSFP224G Passive Direct Attach Cable (DAC).

112G Over-The-Board (OTB) TO 3.2TB Co-packaged Copper

Click to watch our demo showcasing TE’s OTB (Over The Board) cabling system comprised TE’s OIF compliant Co-Packaged Copper module mated to TE’s OIF compliant microLGA fine pitch socket technology.

112G Over-The-Board (OTB) TO 3.2TB Co-packaged Copper

Click to watch our demo showcasing TE’s OTB (Over The Board) cabling system comprised TE’s OIF compliant Co-Packaged Copper module mated to TE’s OIF compliant microLGA fine pitch socket technology.

Power Solutions

Click to watch our power connectors in a live, visual format.

Power Solutions

Click to watch our power connectors in a live, visual format.

LEMBAS LTE/GNSS USB Modem

Click to watch our LEMBAS LTE/GNSS USB modem for LTE CAT4 network (downlink: 150 Mbps, uplink: 50 Mbps) and Integrated GPS tracking designed for use on a wide array of single board computers (SBCs) utilizing ARM processors (32-bit and 64-bit) and running Debian or Ubuntu based Linux OS.

LEMBAS LTE/GNSS USB Modem

Click to watch our LEMBAS LTE/GNSS USB modem for LTE CAT4 network (downlink: 150 Mbps, uplink: 50 Mbps) and Integrated GPS tracking designed for use on a wide array of single board computers (SBCs) utilizing ARM processors (32-bit and 64-bit) and running Debian or Ubuntu based Linux OS.

DesignCon 2022 Demos

Click to watch our innovative solutions we presented at DesignCon 2022.

Co-Packaged Socket Technology

Co-Packaged Socket Technology

DDR5 DIMM SOCKET

DDR5 DIMM SOCKET

Next Generation PCIe Link with CDFP Technology

Next Generation PCIe Link with CDFP Technology

800G QSFP-DD Active Copper Cable

800G QSFP-DD Active Copper Cable

Cabled Card Electromechanical (CEM) Technology

Cabled Card Electromechanical (CEM) Technology

Power Demo Rack

Power Demo Rack

designcon 2021

Industry Tradeshow

DesignCon 2023

Enabling Next Gen Architectures

January 31, 2023 - February 2, 2023

Santa Clara Convention Center

Santa Clara, CA | USA

DesignCon 2023 Demos

Click to watch our innovative solutions we presented at DesignCon 2023.

800G Active Cables (AOC, AEC, ACC)

Click to watch our 800G OSFP active copper cable (ACC) demonstrate the latest in TE’s bulk cable and termination technology.

800G Active Cables (AOC, AEC, ACC)

Click to watch our 800G OSFP active copper cable (ACC) demonstrate the latest in TE’s bulk cable and termination technology.

224G Architectures Enabling AI & Networking

Click to watch our 224G Gbps AdrenaLINE Catapult near-chip connector enable Over-The-Board (OTB) pluggable IO ports as well as cabled backplane systems (AdrenaLINE Slingshot). 

224G Architectures Enabling AI & Networking

Click to watch our 224G Gbps AdrenaLINE Catapult near-chip connector enable Over-The-Board (OTB) pluggable IO ports as well as cabled backplane systems (AdrenaLINE Slingshot). 

Next-Gen PCIe Architectures With Cabled Riser Solutions

Click to watch our cabled riser technology enable next levels of system configurability and modularity for system architects and designers.

Next-Gen PCIe Architectures With Cabled Riser Solutions

Click to watch our cabled riser technology enable next levels of system configurability and modularity for system architects and designers.

1.6TB OSFP 1 meter Passive Copper Cable

Click to watch our latest cable technologies and OSFP connector design along with advanced termination techniques and advanced PCB laminates. Here we are demonstrating this with Intel’s 224G PHY test chip and our OSFP224G Passive Direct Attach Cable (DAC).

1.6TB OSFP 1 meter Passive Copper Cable

Click to watch our latest cable technologies and OSFP connector design along with advanced termination techniques and advanced PCB laminates. Here we are demonstrating this with Intel’s 224G PHY test chip and our OSFP224G Passive Direct Attach Cable (DAC).

112G Over-The-Board (OTB) TO 3.2TB Co-packaged Copper

Click to watch our demo showcasing TE’s OTB (Over The Board) cabling system comprised TE’s OIF compliant Co-Packaged Copper module mated to TE’s OIF compliant microLGA fine pitch socket technology.

112G Over-The-Board (OTB) TO 3.2TB Co-packaged Copper

Click to watch our demo showcasing TE’s OTB (Over The Board) cabling system comprised TE’s OIF compliant Co-Packaged Copper module mated to TE’s OIF compliant microLGA fine pitch socket technology.

Power Solutions

Click to watch our power connectors in a live, visual format.

Power Solutions

Click to watch our power connectors in a live, visual format.

LEMBAS LTE/GNSS USB Modem

Click to watch our LEMBAS LTE/GNSS USB modem for LTE CAT4 network (downlink: 150 Mbps, uplink: 50 Mbps) and Integrated GPS tracking designed for use on a wide array of single board computers (SBCs) utilizing ARM processors (32-bit and 64-bit) and running Debian or Ubuntu based Linux OS.

LEMBAS LTE/GNSS USB Modem

Click to watch our LEMBAS LTE/GNSS USB modem for LTE CAT4 network (downlink: 150 Mbps, uplink: 50 Mbps) and Integrated GPS tracking designed for use on a wide array of single board computers (SBCs) utilizing ARM processors (32-bit and 64-bit) and running Debian or Ubuntu based Linux OS.

DesignCon 2022 Demos

Click to watch our innovative solutions we presented at DesignCon 2022.

Co-Packaged Socket Technology

Co-Packaged Socket Technology

DDR5 DIMM SOCKET

DDR5 DIMM SOCKET

Next Generation PCIe Link with CDFP Technology

Next Generation PCIe Link with CDFP Technology

800G QSFP-DD Active Copper Cable

800G QSFP-DD Active Copper Cable

Cabled Card Electromechanical (CEM) Technology

Cabled Card Electromechanical (CEM) Technology

Power Demo Rack

Power Demo Rack