Industry Tradeshow
Open Compute Project (OCP)
Thank you for attending Open Compute Project (OCP) 2020
May 12-14, 2020
Virtual Summit
EVERY CONNECTION COUNTS
We continue to make efforts to ensure smooth operations and the health and safety of our employees globally by deploying pandemic preparedness plans that include actions centered around people safety, business operations, supply chain integrity and technology processes.
The OCP NIC 3.0 is a form factor enabling our community and created through the collaboration by our community. Within the industry has been the establishment of the connector defined within SFF-TA-1002. These two specifications have created a successful union that will foster new technologies for generations of today and the foreseen future and beyond. Click to watch video to learn more.
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High Speed Input/Output & OTB Portfolio Overview (English)
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Co-Packaging Socket Technology Overview (English)
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External PCIe Solutions (English)
These products provide simple yet customizable designs that enable a standardized platform capable of efficiently distributing up to 500A of power per UL and CSA criteria, while offering improved electrical performance. Engineered solutions support multiple voltage requirements, low resistance and low milli-volt drop. Designers can realize operational and overall system cost savings with TE power products that support low energy consumption. These products are compatible with specifications for use in rack-level bus bar applications including power shelves, battery backup unit (BBU) shelves, IT trays and server sleds.
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DesignCon 2020 Live Demo - 112G STRADA Whisper Backplane Connections (English)
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DesignCon 2020 Live Demo - Thermal Bridge Improved Thermal Management
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DesignCon 2020 Live Demo - 800G Copper Link OSFP Passive Cable
Industry Tradeshow
Open Compute Project (OCP)
Thank you for attending Open Compute Project (OCP) 2020
May 12-14, 2020
Virtual Summit
EVERY CONNECTION COUNTS
We continue to make efforts to ensure smooth operations and the health and safety of our employees globally by deploying pandemic preparedness plans that include actions centered around people safety, business operations, supply chain integrity and technology processes.
The OCP NIC 3.0 is a form factor enabling our community and created through the collaboration by our community. Within the industry has been the establishment of the connector defined within SFF-TA-1002. These two specifications have created a successful union that will foster new technologies for generations of today and the foreseen future and beyond. Click to watch video to learn more.
-
High Speed Input/Output & OTB Portfolio Overview (English)
-
Co-Packaging Socket Technology Overview (English)
-
External PCIe Solutions (English)
These products provide simple yet customizable designs that enable a standardized platform capable of efficiently distributing up to 500A of power per UL and CSA criteria, while offering improved electrical performance. Engineered solutions support multiple voltage requirements, low resistance and low milli-volt drop. Designers can realize operational and overall system cost savings with TE power products that support low energy consumption. These products are compatible with specifications for use in rack-level bus bar applications including power shelves, battery backup unit (BBU) shelves, IT trays and server sleds.
-
DesignCon 2020 Live Demo - 112G STRADA Whisper Backplane Connections (English)
-
DesignCon 2020 Live Demo - Thermal Bridge Improved Thermal Management
-
DesignCon 2020 Live Demo - 800G Copper Link OSFP Passive Cable
