Industry Tradeshow
OCP EMEA Summit 2025
Join TE Connectivity at OCP EMEA Summit!
April 29-30, 2025
Dublin, Ireland
Booth B3
Visit TE Connectivity at the OCP EMEA Summit!
TE Connectivity (TE) is empowering the artificial intelligence (AI) and machine learning (ML) evolution through a robust portfolio of interconnected solutions engineered for high speed and power efficiency in data center architectures.
TE's product displays and partnerships at the OCP Global Summit will demonstrate how our latest innovations around high-speed connectivitiy and power and cooling solutions (liquid, thermal, immersion), are enabling our customers to build the next generation of AI systems.
Product Solutions on Display at OCP EMEA
Liquid Cooled Power Busbar Assembly: TE is enabling the next-gen power busbar solutions helping to empower the AI evolution. As rack level power requirements continue to increase, power busbar capacities need to follow suit. Liquid cooling solutions are helping to deliver higher power distribution and more efficient cooling for high-density data center racks. By incorporating liquid cooling technology into existing rack infrastructures, TE is enabling customers to meet the growing power demands of AI workloads, without increasing busbar footprint.
Power Distribution for Data Center Racks: Featuring TE’s latest solutions compatible with Open Rack v3 (ORv3) power distribution. TE's solutions for high power distribution support effectiveness, safety, high/low volume production, and reliability. This product showcase will highlight the latest power distribution products, featuring input/output interconnect solutions, integrated busbar assemblies, custom power cable assemblies, quick connect and disconnect high power RAPID LOCK cable assemblies, CROWN CLIP Jr. busbar clip, ELCON Mini connector solutions, high current card edge products, and next generation MULTI-BEAM Plus power connectors.
Advanced High-Speed I/O Liquid Cooling & Thermal Bridge Hybrid Solution: TE is showcasing our next-generation thermal solution for future high-speed I/O products. By combining TE's patented thermal bridge components with a liquid cooling cold plate structure, TE presents the market with this efficient technology for solving some of the most challenging thermal problems.
Connecting the Future of AI & HPC: As a leader in advanced connectivity solutions, TE is delivering cutting-edge high-speed I/O interconnects that drive performance in the most demanding applications, including AI, HPC, and data centers. Designed for speed, scalability, and reliability, TE's high-speed I/O product line enables next-generation system architectures with unparalleled efficiency.
Industry Tradeshow
OCP EMEA Summit 2025
Join TE Connectivity at OCP EMEA Summit!
April 29-30, 2025
Dublin, Ireland
Booth B3
Visit TE Connectivity at the OCP EMEA Summit!
TE Connectivity (TE) is empowering the artificial intelligence (AI) and machine learning (ML) evolution through a robust portfolio of interconnected solutions engineered for high speed and power efficiency in data center architectures.
TE's product displays and partnerships at the OCP Global Summit will demonstrate how our latest innovations around high-speed connectivitiy and power and cooling solutions (liquid, thermal, immersion), are enabling our customers to build the next generation of AI systems.
Product Solutions on Display at OCP EMEA
Liquid Cooled Power Busbar Assembly: TE is enabling the next-gen power busbar solutions helping to empower the AI evolution. As rack level power requirements continue to increase, power busbar capacities need to follow suit. Liquid cooling solutions are helping to deliver higher power distribution and more efficient cooling for high-density data center racks. By incorporating liquid cooling technology into existing rack infrastructures, TE is enabling customers to meet the growing power demands of AI workloads, without increasing busbar footprint.
Power Distribution for Data Center Racks: Featuring TE’s latest solutions compatible with Open Rack v3 (ORv3) power distribution. TE's solutions for high power distribution support effectiveness, safety, high/low volume production, and reliability. This product showcase will highlight the latest power distribution products, featuring input/output interconnect solutions, integrated busbar assemblies, custom power cable assemblies, quick connect and disconnect high power RAPID LOCK cable assemblies, CROWN CLIP Jr. busbar clip, ELCON Mini connector solutions, high current card edge products, and next generation MULTI-BEAM Plus power connectors.
Advanced High-Speed I/O Liquid Cooling & Thermal Bridge Hybrid Solution: TE is showcasing our next-generation thermal solution for future high-speed I/O products. By combining TE's patented thermal bridge components with a liquid cooling cold plate structure, TE presents the market with this efficient technology for solving some of the most challenging thermal problems.
Connecting the Future of AI & HPC: As a leader in advanced connectivity solutions, TE is delivering cutting-edge high-speed I/O interconnects that drive performance in the most demanding applications, including AI, HPC, and data centers. Designed for speed, scalability, and reliability, TE's high-speed I/O product line enables next-generation system architectures with unparalleled efficiency.
