Internal Cabled Interconnects for Data Centers & AI

Product Category

INTERNAL CABLED INTERCONNECT SOLUTIONS

TE Connectivity (TE) offers one of the most flexible and highest performing internal cabled and card edge interconnect portfolios in the market.

Our extensive portfolio consists of Sliver connector products (including versions compliant with SFF-TA-1002), SlimSAS products, SlimSAS Low Profile (LP) products and Mini Cool Edge IO (MCIO) products. These connectors and cable assemblies can be used across many applications, data rates and protocols including PCI Express, SAS and Ethernet.
This new technology simplifies design and helps lower overall costs by eliminating the need for re-timers and more costly lower-loss PCB materials while reaching speeds up to 56 Gbps with the use of TE high speed cable.

Sliver Internal Cabled Interconnects
Mini Cool Edge IO (MCIO) connectors
Sliver Direct to Lead Frame (DLF) Cable Assembly
CEM Connectors
Sliver Internal Cabled Interconnects
Mini Cool Edge IO (MCIO) connectors
Sliver Direct to Lead Frame (DLF) Cable Assembly
CEM Connectors

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Sliver Internal Cabled Interconnects

Our Sliver internal cabled interconnect system can provide a solution to data rate increase challenges. It is flexible, robust and provides optimal signal integrity – while also saving space and lowering design costs. With a 0.6mm contact pitch, Sliver interconnect products are super slim, allowing you to fit more inside the box.

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Mini Cool Edge IO (MCIO) connectors

MINI COOL EDGE IO internal cabled interconnects address the SFF-TA-1016 next-generation industry standard and support PCIe Gen 5 applications.

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Sliver Direct to Lead Frame (DLF) Cable Assembly

TE Connectivity's (TE) new Sliver DLF cable assembly is a high speed and high-density solution which can help improve system performance, while helping reduce system design complexity and costs. It can enable system modular design by separating motherboard from I/O peripherals.

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CEM Connectors

TE Connectivity's (TE) PCIe Gen 5 CEM connectors are backward compatible with all generations of PCI Express signaling and address the needs of higher speed performance with a roadmap of data rates that can reach up to 32 gigtransfers per second (GT/s) per differential signal pair.

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